© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD uConnect Grp 3
Mode:
MDD project group 3 circuit design
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | 4.7uF | C1,C2 | CAP-TH_BD8.0-P3.50-D0.6-FD | 2 | LCSC | C435375 | AISHI(Aihua Group) | EGN2GM4R7F12OTS3 | Extended Part |
2 | 100nF | C3,C4 | CAP-TH_L5.5-W2.0-P5.00-D1.0 | 2 | LCSC | C353904 | Dersonic | CC1H104ZC1PD3F5P3003 | Extended Part |
3 | 77311-462K04LF | H1 | HDR-TH_4P-P2.54-V-M-1 | 1 | LCSC | C180218 | Amphenol ICC | 77311-462K04LF | Extended Part |
4 | PH-00294 | H2 | HDR-TH_3P-P2.54-V-M-B | 1 | LCSC | C2829878 | Liansheng(连盛) | PH-00294 | Extended Part |
5 | 150 | R1 | RES-TH_BD1.8-L3.2-P7.20-D0.4 | 1 | LCSC | C337125 | FlyWin | MF1/8W ±1% 150Ω OTB5 | Extended Part |
6 | 10K | R2 | RES-TH_BD3.3-L9.2-P13.20-D0.6 | 1 | LCSC | C433633 | TyoHM | RN 1WS 10K F T/B A1 | Extended Part |
7 | 680K | R3,R4 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 2 | LCSC | C173038 | YAGEO | MFR-25FTE52-680K | Extended Part |
8 | 6.8K | R5,R6 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 2 | LCSC | C274448 | Futaba Elec | RNS14F6801A520NH | Extended Part |
9 | 47K | R7,R8 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 2 | LCSC | C385515 | TyoHM | RN1/2WS47KΩFT/BA1 | Extended Part |
10 | MCP6004T-E/SL | U3 | SOIC-14_L8.7-W3.9-P1.27-LS6.0-BL | 1 | LCSC | C116668 | MICROCHIP | MCP6004T-E/SL | Extended Part |
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