© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD uConnect Grp 3
License: Public Domain
Mode: Editors' pick
MDD project group 3 circuit design
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | 4.7uF | C1,C2 | CAP-TH_BD8.0-P3.50-D0.6-FD | 2 | LCSC | C435375 | AISHI(Aihua Group) | EGN2GM4R7F12OTS3 | Extended Part |
2 | 100nF | C3,C4 | CAP-TH_L5.5-W2.0-P5.00-D1.0 | 2 | LCSC | C353904 | Dersonic | CC1H104ZC1PD3F5P3003 | Extended Part |
3 | 77311-462K04LF | H1 | HDR-TH_4P-P2.54-V-M-1 | 1 | LCSC | C180218 | Amphenol ICC | 77311-462K04LF | Extended Part |
4 | PH-00294 | H2 | HDR-TH_3P-P2.54-V-M-B | 1 | LCSC | C2829878 | Liansheng(连盛) | PH-00294 | Extended Part |
5 | 150 | R1 | RES-TH_BD1.8-L3.2-P7.20-D0.4 | 1 | LCSC | C337125 | FlyWin | MF1/8W ±1% 150Ω OTB5 | Extended Part |
6 | 10K | R2 | RES-TH_BD3.3-L9.2-P13.20-D0.6 | 1 | LCSC | C433633 | TyoHM | RN 1WS 10K F T/B A1 | Extended Part |
7 | 680K | R3,R4 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 2 | LCSC | C173038 | YAGEO | MFR-25FTE52-680K | Extended Part |
8 | 6.8K | R5,R6 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 2 | LCSC | C274448 | Futaba Elec | RNS14F6801A520NH | Extended Part |
9 | 47K | R7,R8 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 2 | LCSC | C385515 | TyoHM | RN1/2WS47KΩFT/BA1 | Extended Part |
10 | MCP6004T-E/SL | U3 | SOIC-14_L8.7-W3.9-P1.27-LS6.0-BL | 1 | LCSC | C116668 | MICROCHIP | MCP6004T-E/SL | Extended Part |
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