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Standard
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
Profession
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
Ongoing
STD L298N
License: CERN Open Hardware License
Mode: Editors' pick
- 0
Update time：
2021-09-27 11:48:07
Creation time：
2021-09-27 08:49:07
Description
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Design Drawing
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| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
|---|---|---|---|---|---|---|---|---|
| 1 | 220uF | C1,C2 | CAP-SMD_BD8.0-L8.3-W8.3-FD | 2 | LCSC | C165523 | SamYoung Electronics | - |
| 2 | FWF25012-S03S22W1B | CN1 | CONN-TH_3P-P2.50_FWF25012-S03S22W1B | 1 | LCSC | C456594 | TXGA | FWF25012-S03S22W1B |
| 3 | 2EDGV-5.08-02P-14-100A(H) | CN3 | CONN-TH_P5.08_2EDGV-5.08-02P-14-100A-H | 1 | LCSC | C581326 | DEGSON | 2EDGV-5.08-02P-14-100A(H) |
| 4 | 1N4007G | D1,D2,D3,D4,D5,D6,D7,D8 | SMA_L4.4-W2.6-LS5.0-RD | 8 | LCSC | C111122 | SK | 1N4007G |
| 5 | TERMINAL BLOK 3 KAKI BIRU | U1 | CONN-TH_3P-P5.08_JL301-50003U01 | 1 | LCSC | C395215 | JILN | JL301-50003U01 |
| 6 | 23.5*16*25 2个钉散热片 | U3 | HEATSINK-TH_L23.5-W16.0-P18.0_XSD2156-067 | 1 | LCSC | C4661 | XSD(鑫顺达) | 23.5*16*25 2个钉散热片 |
| 7 | L298N | U5 | MULTIWATT-15_L19.6-W5.0-P1.27-L | 1 | LCSC | C434589 | HGSEMI | L298N |
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