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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-09-07 19:09:59
Creation time: 2017-11-18 18:41:43
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ID Name Designator Footprint Quantity
1 100uF C1 CP_5X6MM 1
2 470nF C2 RAD-197 1
3 4700u C3,C4 CAP-D10.0XF5.0 2
4 1u C5,C6,C7 RAD-0.2 3
5 vcc LED1 LED-5MM/2.54 1
6 out 4 LED2 LED-3MM/2.54 1
7 WIRELESS-NRF24L01 M1 NRF24L01+ PA LNA 1
8 mr P1,P2 WJ2EDGVC-5.08-2P 2
9 power P3 WJ2EDGVC-5.08-2P 1
10 out 4 P4 WJ2EDGVC-5.08-2P 1
11 Header-Male-2.54_2x4 P6 HDR-4X2/2.54 1
12 IRF3205 Q1,Q2,Q5,Q6,Q9 TO-220AB 5
13 IRF4905 Q3,Q4,Q7,Q8 TO-220AB 4
14 1k R1,R20 AXIAL-0.3 2
15 100 R2,R3,R6,R11,R14 AXIAL-0.4 5
16 10k R4,R5,R9,R10,R12,R13,R17,R18,R19 AXIAL-0.4 9
17 1k R7,R8,R15,R16 AXIAL-0.4 4
18 10k R30 AXIAL-0.3 1
19 2k R31 AXIAL-0.3 1
20 2N2222 T1,T2,T3,T4 TO92-EBC-OVAL 4
21 ARDUINO MEGA 2560 U3 ARDUINO_MEGA-PRO-3.3V 1

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