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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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Std EditionWEGABOX 5.4
Profile:Project profile Project profile required0/500
License: GPL 3.0
Project source: Cloned from WEGABOX 5.3
Версия 5.4 (wega-box) - попытка полного заводского производства платы с монтажом с переходом на smd, отсутсвует usb, требуется USB-TTL для первичной прошивки, имеется разводка и для подключения и управления до 16 насосами на 12V или 4мя шаговыми двигателями для дозера. Заказ выкуплен в складчину, ожидается получение в железе, состояние работы неизвестно, ошибок в схемотехнике пока не замечено
Sheet_1 - measurement
Open in editorSheet_2 - power
Open in editorJACK-s
Open in editorPCB_WEGABOX 5.4
Open in editorID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part |
---|---|---|---|---|---|---|---|---|
1 | PJ-3200B-4A | 1-WIRE,EC/NTC,I2C,PR,US | AUDIO-TH_PJ-3200B-4A | 5 | LCSC | HRO | PJ-3200B-4A | C136687 |
2 | K2-1110SP-A4SC-04 | BOOT,RESET | KEY-SMD_4P-L6.2-W6.2-P4.50-LS9.00 | 2 | LCSC | Korean Hroparts Elec | K2-1110SP-A4SC-04 | C223810 |
3 | 220uF | C1,C3 | CAP-SMD_BD6.3-L6.6-W6.6-FD | 2 | LCSC | HONOR | RVT1C221M0607 | C3342 |
4 | 10uF | C2,C4 | C0805 | 2 | LCSC | FH | 0805X106K100NT | C90543 |
5 | DC-005-20A_C136744 | DC12V | DC-IN-TH_DC-005-20A | 1 | LCSC | HRO | DC-005-20A | C136744 |
6 | PZ254V-11-04P | I2C-1,I2C-2 | HDR-TH_4P-P2.54-V-M | 2 | LCSC | XFCN | PZ254V-11-04P | C492403 |
7 | 33uH | L1 | IND-SMD_L6.0-W6.0_SLW6045 | 1 | LCSC | Sunltech Tech | SLW6045S330MST | C206296 |
8 | 6.8uH | L2 | IND-SMD_L4.4-W4.2 | 1 | LCSC | Sunlord | MWSA0402S-6R8MT | C408338 |
9 | 10K | R1 | R1206 | 1 | LCSC | Walsin Tech Corp | WR12X103 JTL | C384031 |
10 | 4.7K | R2,R3,R4,R5,R9,R10 | R1206 | 6 | LCSC | YAGEO | RC1206FR-074K7L | C137262 |
11 | 100K | R6 | R1206 | 1 | LCSC | YAGEO | RC1206JR-07100KL | C136470 |
12 | 510 | R7 | R1206 | 1 | LCSC | YAGEO | RC1206FR-07510RL | C114946 |
13 | 330 | R8 | R1206 | 1 | LCSC | WTC | WR12X3300FTL | C168539 |
14 | DOSIN-801-0031 | RF1 | BNC-TH_DOSIN-801-0030 | 1 | LCSC | dosinconn | DOSIN-801-0031 | C521205 |
15 | SS34F_C908239 | SS34 | SMAF_L3.5-W2.6-LS4.7-FD | 1 | LCSC | FUXINSEMI | SS34F | C908239 |
16 | 12251103CNG0S115001 | TTL | HDR-TH_3P-P2.54-V-M-1 | 1 | LCSC | JILN | 12251103CNG0S115001 | C429954 |
17 | ISO1540DR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | TI | ISO1540DR | C179739 |
18 | LM336MX-2.5/NOPB | U2 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | Texas Instruments | LM336MX-2.5/NOPB | C529309 |
19 | ESP32-WROOM-32D(16MB) | U4 | WIFIM-SMD_39P-L25.5-W18.0-P1.27-BL | 1 | LCSC | Espressif Systems | ESP32-WROOM-32D(16MB) | C529578 |
20 | MCP3421A0T-E/CH | U5 | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | 1 | LCSC | MICROCHIP | MCP3421A0T-E/CH | C29454 |
21 | B0305S-1WR2 | U6 | PWRM-TH_BXXXXS-1WR2 | 1 | LCSC | MORNSUN | B0305S-1WR2 | C80854 |
22 | MCP602-I/SN | U9 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | MICROCHIP | MCP602-I/SN | C29605 |
23 | LM2596S-3.3 P+ | LM2569-3 | TO-263-5_L10.2-W8.9-P1.70-TL | 1 | LCSC | JSMSEMI | LM2596S-3.3 P+ | C963383 |
24 | IC seat 16P | DRV1,DRV2,DRV3,DRV4 | DIP-16_L20.3-W10.2-P2.54-LS7.6-BL | 4 | LCSC | Boom Precision Elec | - | C2326 |
25 | PZ254V-12-24P | H1 | HDR-TH_24P-P2.54-V-M-R2-C12-S2.54 | 1 | LCSC | XFCN | PZ254V-12-24P | C492429 |
26 | MCP23017-E/SO | U3 | SOIC-28_L18.0-W7.5-P1.27-LS10.3-BL | 1 | LCSC | MICROCHIP | MCP23017-E/SO | C47023 |
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