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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD WEGABOX 5.4
Profile:Project profile Project profile required0/500
License: GPL 3.0
Project source: Cloned from WEGABOX 5.3
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part |
---|---|---|---|---|---|---|---|---|
1 | PJ-3200B-4A | 1-WIRE,EC/NTC,I2C,PR,US | AUDIO-TH_PJ-3200B-4A | 5 | LCSC | HRO | PJ-3200B-4A | C136687 |
2 | K2-1110SP-A4SC-04 | BOOT,RESET | KEY-SMD_4P-L6.2-W6.2-P4.50-LS9.00 | 2 | LCSC | Korean Hroparts Elec | K2-1110SP-A4SC-04 | C223810 |
3 | 220uF | C1,C3 | CAP-SMD_BD6.3-L6.6-W6.6-FD | 2 | LCSC | HONOR | RVT1C221M0607 | C3342 |
4 | 10uF | C2,C4 | C0805 | 2 | LCSC | FH | 0805X106K100NT | C90543 |
5 | DC-005-20A_C136744 | DC12V | DC-IN-TH_DC-005-20A | 1 | LCSC | HRO | DC-005-20A | C136744 |
6 | PZ254V-11-04P | I2C-1,I2C-2 | HDR-TH_4P-P2.54-V-M | 2 | LCSC | XFCN | PZ254V-11-04P | C492403 |
7 | 33uH | L1 | IND-SMD_L6.0-W6.0_SLW6045 | 1 | LCSC | Sunltech Tech | SLW6045S330MST | C206296 |
8 | 6.8uH | L2 | IND-SMD_L4.4-W4.2 | 1 | LCSC | Sunlord | MWSA0402S-6R8MT | C408338 |
9 | 10K | R1 | R1206 | 1 | LCSC | Walsin Tech Corp | WR12X103 JTL | C384031 |
10 | 4.7K | R2,R3,R4,R5,R9,R10 | R1206 | 6 | LCSC | YAGEO | RC1206FR-074K7L | C137262 |
11 | 100K | R6 | R1206 | 1 | LCSC | YAGEO | RC1206JR-07100KL | C136470 |
12 | 510 | R7 | R1206 | 1 | LCSC | YAGEO | RC1206FR-07510RL | C114946 |
13 | 330 | R8 | R1206 | 1 | LCSC | WTC | WR12X3300FTL | C168539 |
14 | DOSIN-801-0031 | RF1 | BNC-TH_DOSIN-801-0030 | 1 | LCSC | dosinconn | DOSIN-801-0031 | C521205 |
15 | SS34F_C908239 | SS34 | SMAF_L3.5-W2.6-LS4.7-FD | 1 | LCSC | FUXINSEMI | SS34F | C908239 |
16 | 12251103CNG0S115001 | TTL | HDR-TH_3P-P2.54-V-M-1 | 1 | LCSC | JILN | 12251103CNG0S115001 | C429954 |
17 | ISO1540DR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | TI | ISO1540DR | C179739 |
18 | LM336MX-2.5/NOPB | U2 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | Texas Instruments | LM336MX-2.5/NOPB | C529309 |
19 | ESP32-WROOM-32D(16MB) | U4 | WIFIM-SMD_39P-L25.5-W18.0-P1.27-BL | 1 | LCSC | Espressif Systems | ESP32-WROOM-32D(16MB) | C529578 |
20 | MCP3421A0T-E/CH | U5 | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | 1 | LCSC | MICROCHIP | MCP3421A0T-E/CH | C29454 |
21 | B0305S-1WR2 | U6 | PWRM-TH_BXXXXS-1WR2 | 1 | LCSC | MORNSUN | B0305S-1WR2 | C80854 |
22 | MCP602-I/SN | U9 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | MICROCHIP | MCP602-I/SN | C29605 |
23 | LM2596S-3.3 P+ | LM2569-3 | TO-263-5_L10.2-W8.9-P1.70-TL | 1 | LCSC | JSMSEMI | LM2596S-3.3 P+ | C963383 |
24 | IC seat 16P | DRV1,DRV2,DRV3,DRV4 | DIP-16_L20.3-W10.2-P2.54-LS7.6-BL | 4 | LCSC | Boom Precision Elec | - | C2326 |
25 | PZ254V-12-24P | H1 | HDR-TH_24P-P2.54-V-M-R2-C12-S2.54 | 1 | LCSC | XFCN | PZ254V-12-24P | C492429 |
26 | MCP23017-E/SO | U3 | SOIC-28_L18.0-W7.5-P1.27-LS10.3-BL | 1 | LCSC | MICROCHIP | MCP23017-E/SO | C47023 |
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