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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD 4 relay
4 relay
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Update time：
2018-07-03 15:27:29
Creation time：
2018-06-01 12:26:05
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| ID | Name | Designator | Footprint | Quantity | Mounted |
|---|---|---|---|---|---|
| 1 | RelayHT3F-12VDC-SHG | J1,J2,J3,J4 | HT3F-12VDC-SHG | 4 | Yes |
| 2 | BC547B Tube | Q1,Q2,Q3,Q4 | TO-92(TO-92-3) | 4 | Yes |
| 3 | 1N4007RLG | D1,D2,D3,D4,D5,D6,D7,D8 | DO-41 | 8 | Yes |
| 4 | Optocoupler | U2,U3,U4,U5 | OPTOCOUPLER PACKAGE | 4 | Yes |
| 5 | 1k | R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12 | AXIAL-0.3 | 12 | Yes |
| 6 | ESP-12F(ESP8266MOD) | U6 | ESP-12F(ESP8266MOD) | 1 | Yes |
| 7 | Fuente5V | U8 | HILINK5V PCB LIB | 1 | Yes |
| 8 | L78L33ACZTR | U1 | TO-92(TO-92-3) | 1 | Yes |
| 9 | 2.54-1*2PFemale | P1,P7,P8,P9,P10,P11 | HDR-1X2/2.54 | 6 | Yes |
| 10 | Header2.54mm 1*3P | P2,P3,P4,P5,P6 | HDR-3X1/2.54 | 5 | Yes |
| 11 | Switch3x4x2 | KEY1 | KEY-3.0*4.0 | 1 | Yes |
| 12 | 4051 | U9 | DIL16 | 1 | Yes |
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