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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads

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Published Time:2021-08-07 02:50:36
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Project

Documents

NODO CENTRAL

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ID Name Designator Footprint Quantity
1 CR1220 BAT1 BATTERY-2-AA 1
2 RST BTN1 SW-SMD_L3.9-W3.0-P4.45 1
3 BOOT BTN2 SW-SMD_L3.9-W3.0-P4.45 1
4 1u C1 CASE-A_3216 1
5 22p C2,C3,C5 C0603 3
6 1u C4 C0603 1
7 100n C6,C7,C9,C10,C11,C12,C16,C19,C22,C23,C24,C25 C0402 12
8 100u, 6.3V C13 CASE-B_3528 1
9 1u C14,C21,C15,C20 C0402 4
10 100u C17,C18 CASE-B_3528 2
11 HYC80-TF08-375 CARD1 HYC80-TF08-XXX 1
12 SIM-106 CARD2 SIM-SMD_SIM-106 1
13 LED CHRG1,CRGD1 0603-LED-ALT1 2
14 JST-PH, 2P CN2 CONN-SMD_2P-P2.00_A2001WR-S-2P-AA 1
15 BAT60A D1 SOD-323_L1.8-W1.3-LS2.5-RD 1
16 SS34 D2 SMA_L4.4-W2.6-LS5.0-RD 1
17 1N5235B D3 DO-35 1
18 SP H5 HDR-F-2.54_1X2 1
19 RA-01SC L1 COMM-SMD_RA-01S 1
20 22uH L2,L3 IND-SMD_L5.0-W5.0_LVS505040 2
21 IRF5210 Q1,Q2 TO-263-2_L10.0-W9.1-P5.08-LS15.2-BR 2
22 2N3904(SOT-23) Q3,Q5 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-TR 2
23 CJ2301 Q4 SOT-23-3_L3.0-W1.7-P0.95-LS2.9-BR 1
24 1k R1,R2,R3,R5,R14,R15,R20,R23 R0603 8
25 10k R7,R8,R9,R10,R12,R13 R0402 6
26 100 R11,R16,R17 R0603 3
27 100k R18,R21,R22 R0402 3
28 330 R19 R0402 1
29 R RP1 RES-ADJ-TH_3386P 1
30 10k NTC Thermistor THM1 THERMISTOR 1
31 UART TTL1 HDR-TH_5P-P2.00-V 1
32 SIM800A 32m U1 GSMM-SMD_SIM800A32M 1
33 ESP32-WROOM-32UC U2 WIFIM-SMD_38P-L19.2-W18.0-P1.27 1
34 LM2596S-12 U3 TO-263-5_L10.0-W8.4-P1.70-LS15.3-BR 1
35 MCP1702 U4 TO-92-3_L4.9-W3.7-P1.27-L 1
36 DS3231MZ+ U5 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1
37 R5460N208AF-TR-FE U6 SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR 1
38 TP5100_C379389 U7 TQFN-16_L4.0-W4.0-P0.65-BL-EP 1
39 BD750L5FP U10 TO-252-2_L6.6-W6.1-P4.57-LS9.9-BR-CW 1

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