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Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD DIY 802.3at PoE+ splitter
Mode:
Read the full guide on diy through-hole poe+ splitter.
This post is part of a series on PoE (power-over-ethernet), see the first two posts here:
In this guide, we are taking the concept one step further by using "smart" PoE, by using the 802.3at standard to negotiate the level of power we want from the PoE switch. Read more about 802.3at specification here.
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | TJ-L5FYTGHGMCGSFLC2G-A5 | POE | LED-TH_BD5.8-P2.54-FD | 1 |
2 | 3.3K | R9 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 |
3 | ETH-IN | ETH-IN | HEADER 1X8 | 1 |
4 | ETH-OUT | ETH-OUT | HEADER 1X8 | 1 |
5 | 1nF | C2,C3,C4,C10 | CAP-TH_L9.0-W5.0-P10.00-D0.7 | 4 |
6 | TPS2379DDAR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL-EP | 1 |
7 | 47uF | C1 | CAP-TH_BD10.0-P5.00-D1.0-FD | 1 |
8 | 100nF | C5 | CAP-TH_L8.5-W5.0-P5.00-D1.2 | 1 |
9 | H6062NL | T1 | XFMR-SMD_H5007NLT | 1 |
10 | OUT- | - | PADPAD | 1 |
11 | OUT+ | + | PADPAD | 1 |
12 | DB107_C84061 | D1,D2 | DIO-BG-TH_DB107 | 2 |
13 | 75Ω | R1,R2,R3,R4,R5,R6,R7,R8 | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 8 |
14 | 63.4Ω | RCLS | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 1 |
15 | 24.9kΩ | RDEN | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 1 |
16 | 10nF | C6,C7,C8,C9 | CAP-TH_L8.5-W5.0-P5.00-D1.2 | 4 |
17 | 1X2 | J1 | HDR-TH_2P-P2.54-V | 1 |
18 | VOUT | OUT | HDR-TH_2P-P2.54-V | 1 |
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