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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD DIY 802.3at PoE+ splitter
Mode:
Read the full guide on diy through-hole poe+ splitter.
This post is part of a series on PoE (power-over-ethernet), see the first two posts here:
In this guide, we are taking the concept one step further by using "smart" PoE, by using the 802.3at standard to negotiate the level of power we want from the PoE switch. Read more about 802.3at specification here.
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | TJ-L5FYTGHGMCGSFLC2G-A5 | POE | LED-TH_BD5.8-P2.54-FD | 1 |
2 | 3.3K | R9 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 |
3 | ETH-IN | ETH-IN | HEADER 1X8 | 1 |
4 | ETH-OUT | ETH-OUT | HEADER 1X8 | 1 |
5 | 1nF | C2,C3,C4,C10 | CAP-TH_L9.0-W5.0-P10.00-D0.7 | 4 |
6 | TPS2379DDAR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL-EP | 1 |
7 | 47uF | C1 | CAP-TH_BD10.0-P5.00-D1.0-FD | 1 |
8 | 100nF | C5 | CAP-TH_L8.5-W5.0-P5.00-D1.2 | 1 |
9 | H6062NL | T1 | XFMR-SMD_H5007NLT | 1 |
10 | OUT- | - | PADPAD | 1 |
11 | OUT+ | + | PADPAD | 1 |
12 | DB107_C84061 | D1,D2 | DIO-BG-TH_DB107 | 2 |
13 | 75Ω | R1,R2,R3,R4,R5,R6,R7,R8 | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 8 |
14 | 63.4Ω | RCLS | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 1 |
15 | 24.9kΩ | RDEN | RES-TH_BD2.3-L3.7-P7.70-D0.9 | 1 |
16 | 10nF | C6,C7,C8,C9 | CAP-TH_L8.5-W5.0-P5.00-D1.2 | 4 |
17 | 1X2 | J1 | HDR-TH_2P-P2.54-V | 1 |
18 | VOUT | OUT | HDR-TH_2P-P2.54-V | 1 |
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