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Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD Greenhouse sensor node
Mode:
Greenhouse sensor node under developement.
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer Part | BOM_Manufacturer | BOM_Supplier Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | 47nF | C1 | C0603 | 1 | LCSC | CL10B473KB8NNNC | SAMSUNG(三星) | C1622 | Basic Part |
2 | 100nF | C2,C8,C9,C10,C11,C12,C13,C14,C15 | C0402_NEW | 9 | LCSC | CL05B104KO5NNNC | SAMSUNG(三星) | C1525 | Basic Part |
3 | 33nF | C3,C4,C7 | C0603 | 3 | LCSC | CL10B333KB8NNNC | SAMSUNG(三星) | C21117 | Basic Part |
4 | 10uF | C16,C17 | C1206 | 2 | LCSC | CL31B106KPHNNNE | SAMSUNG(三星) | C96449 | Extended Part |
5 | 22uF | C18 | C1206 | 1 | LCSC | CL31A226KPHNNNE | SAMSUNG(三星) | C5672 | Basic Part |
6 | LESD5D5.0CT1G | D1,D2,D3,D4,D5,D6,D9,D10 | SOD-523_L1.2-W0.8-LS1.6-BI | 8 | LCSC | LESD5D5.0CT1G | LRC(乐山无线电) | C383211 | Extended Part |
7 | 105017-0001 | J1 | MICRO-USB-SMD_105017-0001 | 1 | LCSC | 1050170001 | MOLEX | C136000 | Extended Part |
8 | DG308-2.54-04P-14-00A(H) | J2,J4 | CONN-TH_DG308-2.54-04P-14-00A-H | 2 | LCSC | DG308-2.54-04P-14-00A(H) | DEGSON | C708735 | Extended Part |
9 | 210-1S-1*3Ppin Gold-plated | J3 | HDR-TH_3P-P1.27-V-M-1 | 1 | LCSC | B-2101S03P-A110 | Ckmtw(灿科盟) | C124354 | Extended Part |
10 | 0805G (Green) | LED1,LED2 | LED0805-R-RD | 2 | LCSC | KT-0805翠绿 (SMT业务专用) | null | C2297 | Basic Part |
11 | 470Ω | R1,R2 | R0402 | 2 | LCSC | 0402WGF4700TCE | UNI-ROYAL(厚声) | C25117 | Basic Part |
12 | 680Ω | R3 | R0402 | 1 | LCSC | 0402WGF6800TCE | UNI-ROYAL(厚声) | C25130 | Basic Part |
13 | 5.1kΩ | R4 | R0402 | 1 | LCSC | 0402WGF5101TCE | UNI-ROYAL(厚声) | C25905 | Basic Part |
14 | 0Ω | R5,R7,R8,R9 | R0402 | 4 | LCSC | 0402WGF0000TCE | UNI-ROYAL(厚声) | C17168 | Basic Part |
15 | 10kΩ | R6,R10,R11,R12,R16,R17 | R0402 | 6 | LCSC | 0402WGF1002TCE | UNI-ROYAL(厚声) | C25744 | Basic Part |
16 | 1kΩ | R15 | R0402 | 1 | LCSC | 0402WGF1001TCE | UNI-ROYAL(厚声) | C11702 | Basic Part |
17 | PTS645SK43SMTR92LFS | SW1,SW2 | KEY-SMD_4P-L6.0-W6.0-P4.50-LS9.0 | 2 | LCSC | PTS645SK43SMTR92LFS | C&K | C221871 | Extended Part |
18 | AMS1117-3.3_C347222 | U1 | SOT-223-4_L6.5-W3.5-P2.30-LS7.0-BR | 1 | LCSC | AMS1117-3.3 | UMW(广东友台半导体) | C347222 | Extended Part |
19 | MAX3221ECPWR | U2 | TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL | 1 | LCSC | MAX3221ECPWR | TI(德州仪器) | C350553 | Extended Part |
20 | ESP32-C3-MINI-1-N4(4MB) | U3 | WIFIM-SMD_ESP32-C3-MINI-1 | 1 | LCSC | ESP32-C3-MINI-1-N4(4MB) | ESPRESSIF(乐鑫) | C2934561 | Extended Part |
21 | AGS10 | U4 | SENSOR-SMD_AGS10 | 1 | LCSC | AGS10 | 广州奥松 | C3012632 | Extended Part |
22 | SHTC3-10000 | U5 | DFN-4_L2.0-W2.0-P1.00-BL-EP | 1 | LCSC | SHTC3-10000 | Sensirion(瑞士盛思锐) | C2880044 | Extended Part |
23 | BH1621FVC-TR | U6 | WSOF-5_L1.6-W1.2-P0.50-LS1.6-TL | 1 | LCSC | BH1621FVC-TR | ROHM(罗姆) | C79640 | Extended Part |
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