© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD PCB2
Mode:
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
---|---|---|---|---|---|---|---|---|
1 | 1K | U16,U14,U12,U13,U11,U9,U7,U6,U2,U1 | RES-TH_BD3.5-L9.0-P13.00-D0.8 | 10 | LCSC | C479442 | FlyWin | MO1WS-1K±5%-2T52 |
2 | 1000uF | C2 | CAP-TH_BD10.0-P5.00-D1.0-FD | 1 | LCSC | C150381 | SAMYOUNG | NXA25V1000UF10*20 |
3 | LM741CN | U15,U10,U8,U3 | DIP-8_L9.8-W6.6-P2.54-LS7.6-BL | 4 | LCSC | C13974 | TI | LM741CN |
4 | LMDL914 | D1,D3 | SOD-323_L1.8-W1.3-LS2.5-RD | 2 | LCSC | C402261 | LGE | LMDL914 |
5 | Header-Male-2.54_1x4_C59481 | H11 | HDR-TH_4P-P2.54-V | 1 | LCSC | C59481 | ReliaPro | Headers Pins 1*4P |
6 | 319nF | C4 | CAP-TH_L13.5-W8.0-P7.50-D1.2 | 1 | LCSC | C185956 | SHINYEI | - |
7 | 10K | R1 | R0603 | 1 | LCSC | C136944 | YAGEO | RT0603DRD0710KL |
8 | 1K | U17 | RES-SMD_L3.5-W1.5 | 1 | LCSC | C265817 | Thunder Component | MElF-MFR02041/4WS1.05KΩFT50 |
9 | 33uF | C1 | CAP-TH_BD5.0-P2.00-D0.8-FD | 1 | LCSC | C47902 | ValuePro | 33uF 25V 5*5 |
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