Editor Version ×
Standard

1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 30,000 devices or 100,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

Std Edition24-11-2019

License:

Published Time:2019-11-25 00:13:03
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Description
Documents
ID Name Designator Footprint Quantity
1 STPS10L60D D1,D2,D3 DO-35 3
2 LM5110-1MNOPB U5,U3 SOIC8 2
3 1μF C7,C8,C9,C12,C18 CAP-D3.0XF1.5 5
4 100μF C13,C5 CAP-D3.0XF1.5 2
5 10μF C14,C3 CAP-D3.0XF1.5 2
6 170μF C4 CAP-D3.0XF1.5 1
7 Header ultrasonic PULTR1 HDR-4X1/2.54 1
8 FDP52N20 Q1,Q2 TO-220-3_L10.0-W4.5-P2.54-L 2
9 38.1μH L1 AXIAL-0.4 1
10 PIC16F1789-IP MICRO DIP40 1
11 Header infrared PULTR2 SENSOR-TH_TSOP4X 1
12 10kΩ R1 AXIAL-0.3 1
13 25Ω R4,R8 AXIAL-0.3 2
14 1k R5 AXIAL-0.3 1
15 100k R3,R7,R2,R6 AXIAL-0.3 4
16 U2 6V U2 MOTEUR 1
17 L U1 MOTEUR 1
18 LD1117V50 U6 TO-220-3_L10.0-W4.5-P2.54-T 1
19 Compiler PCOMP HDR-6X1/2.54 1
20 3V-4.2V B2-1307-0000 BAT-TH_BS-2-1 1
21 100n C2,C1 RAD-0.1 2
22 100nF C6 RAD-0.1 1

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