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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD pemf master board v2
Mode:
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | single pad | 3.0V,LIPO+ | SINGLE PAD 3 MM | 2 |
2 | SINGLE HOLE | 3.0VGND,LIPO- | 1.2MM HOLE 2MM PAD | 2 |
3 | DHT-1163S | ALARMSTOP,LCD,PULSE,RESET | SW2-4.0-6.0X3.0X2.5MM | 4 |
4 | 10uF | C1,C3 | 1206 | 2 |
5 | 100nF | C2,C4 | 1206 | 2 |
6 | 100nF | C5 | C0805 | 1 |
7 | 1uF | C6 | C0805 | 1 |
8 | 100nF | C7 | 0603 | 1 |
9 | B340A-13-F | D1,D2 | SMA(DO-214AC) | 2 |
10 | Signal_pad | EN,PWM,TRIM | SINGLE PAD 1.5X2.5 MM | 3 |
11 | 204-10UYC/S530-A3 | LED1 | LED-3MM/2.54 | 1 |
12 | out+ | OUT+ | SINGLE PAD 3 MM | 1 |
13 | out- | OUT- | 1.2MM HOLE 2MM PAD | 1 |
14 | I2C | P3 | HDR-4X1/2.54 | 1 |
15 | ICP | P4 | HDR-6X1/2.54 | 1 |
16 | pol+ | PWR+ | SINGLE PAD 3 MM | 1 |
17 | pol- | PWR- | 1.2MM HOLE 2MM PAD | 1 |
18 | IRF7401TRPBF | Q1 | SOIC-8_150MIL | 1 |
19 | 10K | R1 | R0603 | 1 |
20 | 10k | R2,R5,R8 | R0603 | 3 |
21 | 50k | R3 | R0603 | 1 |
22 | 150k | R4 | R0603 | 1 |
23 | 1.3k | R6 | R0603 | 1 |
24 | 560k | R7 | 0603 | 1 |
25 | 1k | R9 | 0603 | 1 |
26 | 10k | R10,R11 | 0603 | 2 |
27 | 200K | R12 | RES-ADJ_3224W | 1 |
28 | Header-Male-2.54_1x4 | SMPS-MODULE | HDR-4X1/2.54 | 1 |
29 | K3-1280S-F2 | SW2 | K3-1280S-F2 | 1 |
30 | PIC18F24J11T-IML | U1 | MCHP-QFN-ML28 COPY | 1 |
31 | LTC4413EDD#PBF | U2 | DFN-10-3X3MM | 1 |
32 | SN74LV1T34DBVR | U3 | SOT-23-5 | 1 |
33 | NCP45521IMNTWG-H | U4 | DFN-8_EP_2X2 | 1 |
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