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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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Profile：test plate
Description
test plate
Documents
| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | K4-6×6_SMD | BUT_L,BUT_R,FIRE,RESET | MY_BUT | 4 |
| 2 | 10uF | C1,C3,C4,C5,C8,C10,C16,C17 | C0805 | 8 |
| 3 | 100nF | C6,C7,C9,C18 | C0805 | 4 |
| 4 | Oled I2C OLED 128x64 | GND | MY_OLED | 1 |
| 5 | 0.3 mOhm | L1 | COIL | 1 |
| 6 | 0.36uH | L2,L3 | 1040 INDUCTOR | 2 |
| 7 | BC846 | Q1,Q4 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 2 |
| 8 | BSR15 | Q2,Q3,Q6 | SOT23-3 | 3 |
| 9 | AON6354 | Q7,Q8,Q9,Q10 | DFN5X6-8_9P-L5.3-W6.2-P1.27-BL | 4 |
| 10 | IRFR5305TRPBF | Q11 | TO-252-3_L6.5-W5.8-P4.58-TR | 1 |
| 11 | 3.6 | R1,R2,R4,R6,R25,R26 | R2512 | 6 |
| 12 | 100k | R3,R7,R8,R10 | R0402 | 4 |
| 13 | 10k | R9,R14,R17,R19,R29,R30 | R0402 | 6 |
| 14 | 0.006 | R11,R12,R22 | R2512 | 3 |
| 15 | 10 | R13,R16,R18,R27 | R0402 | 4 |
| 16 | 1k | R15,R28 | R0402 | 2 |
| 17 | AMS1117-5.0 | U1 | SOT-223_L6.5-W3.5-P2.30-LS7.0-BR | 1 |
| 18 | L6743D | U2,U5 | SOIC8 | 2 |
| 19 | ATMEGA328P-AU | U3 | TQFP-32_L7.0-W7.0-P0.80-LS9.0-BL | 1 |
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