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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
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1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
Std EditionHP server Breakout
Description
Breakout board fort HP server Power supplies PL 18 etc
Documents
Fused Breakout
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Simple Board Panelised
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Breakout Non Fused v1 (Ordered)
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Breakout Fused v1 (ordered)
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Breakout Non Fused v2
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Breakout Fused v2
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Breakout Fused v3
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Sheet_1
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Breakout Fused v3.1
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Breakout Fused v3.2
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Breakout Fused v3.3
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Breakout Fused v4.0
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Breakout Fused Fan Control v5.0
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Breakout Fused v5.0
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Breakout Fused v6.0 (ordered)
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Breakout Fused Fan Board v6 (Ordered)
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Breakout Fused v7.0
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Breakout Fused v7.0a
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Breakout Fused Fan Control v7.0
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Sheet_2
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Breakout Fused Fan Board v7a
Open in editor| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 32X2P EDGE SLOT CONNECTOR | CON1 | 32X2P EDGE SLOT CONNECTOR | 1 |
| 2 | XF-506P | FH1,FH2,FH3 | FUSE-TH_XF-506P | 3 |
| 3 | TJ-S3216SW9TGLC0A-A5 | LED1,LED2,LED3 | LED1206-R-RD_ORANGE | 3 |
| 4 | 15-21/BHC-AP1Q2/2T | LED4 | LED1206-R-RD | 1 |
| 5 | 390 | R1 | R1206 | 1 |
| 6 | AS06W2J0472T5E | R2,R3,R4,R5 | R1206 | 4 |
| 7 | MMP122-R | SW1 | SW-TH_MMP122-R | 1 |
| 8 | DBT50G-9.5-3P | U1,U2 | CONN-TH_3P-P9.50_DBT50G-9.5-3P | 2 |
| 9 | 01550900M | FH4 | FUSE-SMD_L9.8-W5.0 | 1 |
| 10 | SZYY1206G | LED5,LED6,LED7 | LED1206-R-RD | 3 |
| 11 | 1MΩ | R6 | RES-ADJ-SMD_3P-L4.5-W4.5-P2.35-BR | 1 |
| 12 | 1K | R7,R8,R9 | R1206 | 3 |
| 13 | 4k7 | R10,R11,R12 | R1206 | 3 |
| 14 | Fan Control | SW2 | SW-TH_MMP122-R | 1 |
| 15 | MP1584EN Module | U3 | MP1584EN-MODULE | 1 |
| 16 | ATTINY85-20SU | U5 | SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL | 1 |
| 17 | UBA-4R-S14H-4S(LF)(SN) | USB1 | USB-SMD_UBA-4R-S14H-4S | 1 |
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