© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD STM32 BlackPill grblHAL BOB
Mode:
grblHAL firmware and STM32F4 driver could be finded on github:
https://github.com/grblHAL
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 0u1 | C1 | C1206 MM MILL_PADS | 1 |
2 | Header-Male-2.54_1x5 | CON_AA,CON_AX,CON_AY,CON_AZ,CON_KEYS,CON_SPNDL | WF-5(DS1070) MM MILL_PADS | 6 |
3 | 210S-1*3P L=11.6MMGold-plated black | CON_CLNT,CON_PRB | WF-3(DS1070) MM MILL_PADS | 2 |
4 | 210S-1*6P L=11.6MMGold-plated black | CON_LMTS,CON_UC | WF-6(DS1070) MM MILL_PADS | 2 |
5 | HDR-F-2.54_1x2 | CON_PWR | EK254V-2(DG308) MILL_PADS | 1 |
6 | 5k1 | R1,R2,R4 | R1206 MM MILL_PADS | 3 |
7 | 6k8 | R3 | R1206 MM MILL_PADS | 1 |
8 | STM32F4 WeAct BlackPill V3.0 | STM32_MDL | STM32 BLACKPILL MODULE MILL_PADS | 1 |
9 | SW_STPPR | SW_AXES | PLS-3(DS1021) MILL_PADS | 1 |
10 | 24LC64-I/P | U1 | SCS-8(DS1009 DIP-8) MILL_PADS | 1 |
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