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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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STD Jawad El.Hindi 29-3-2018
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Description
Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 100KΩ | R23,R25,R27,R29,R31,R32,R33,R34,R35,R36,R37,R38,R39,R40,R41,R42 | AXIAL-0.5 | 16 |
| 2 | 10KΩ | R24,R26,R28,R30 | AXIAL-0.4 | 4 |
| 3 | ULN2803A | Q12,Q14,Q16,Q18 | DIP-18 | 4 |
| 4 | BDX54B | Q13,Q15,Q17,Q19 | TO-220 | 4 |
| 5 | 7805 | U1 | TO252 | 1 |
| 6 | WJ124-3.81-2P | 12,5,DP | KF124-3.81-2P | 3 |
| 7 | BDX53C | Q20 | TO-220(TO-220-3) | 1 |
| 8 | 1.25T-1-12AW | CN2 | 1.25T-1-12AW | 1 |
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