**General Description**:
The MPU-6500 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer,
and a Digital Motion Processor™ (DMP) all in a small 3x3x0.9mm package. It also features a 4096-byte
FIFO that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the
system processor to burst read sensor data and then go into a low-power mode. With its dedicated I 2C
sensor bus, the MPU-6500 directly accepts inputs from external I 2C devices. MPU-6500, with its 6-axis
integration, on-chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly
and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal
motion performance for consumers. MPU-6500 is also designed to interface with multiple non-inertial digital
sensors, such as pressure sensors, on its auxiliary I 2C port.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very
low rate noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale range
of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line
calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock
with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The
device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital
IO supply, VDDIO from 1.71V to 3.6V.
Communication with all registers of the device is performed using either I 2C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x0.90mm (24-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.
**Features**:
2.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-6500 includes a wide range of features:
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Factory calibrated sensitivity scale factor
Self-test
2.2 Accelerometer Features
The triple-axis MEMS accelerometer in MPU-6500 includes a wide range of features:
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g,
±8g and ±16g and integrated 16-bit ADCs
Accelerometer normal operating current: 450µA
Low power accelerometer mode current: 6.37µA at 0.98Hz, 17.75µA at 31.25Hz
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
2.3 Additional Features
The MPU-6500 includes the following additional features:
Auxiliary master I 2C bus for reading data from external sensors (e.g. magnetometer)
3.4mA operating current when all 6 motion sensing axes are active
VDD supply voltage range of 1.8 – 3.3V ± 5%
VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I2C devices
Smallest and thinnest QFN package for portable devices: 3x3x0.9mm
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
4096 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I 2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
2.4 MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionProcessing and low
power functions such as gesture recognition using programmable interrupts
In addition to the angular rate, this device optionally outputs the angular position (angle).
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
**Applications**:
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports