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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD LM 24/12

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Update time: 2021-04-10 10:04:50
Creation time: 2016-05-30 06:09:08
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ID Name Designator Footprint Quantity
1 DS1307 U1 DIP8 1
2 ATmega8-16PU U2 DIP28 1
3 32768 Q1 1X02 1
4 10k R1,R2,R3,R4,R5 R3 5
5 3v G1 2PIN 1
6 100n C1 C1 1
7 BUZZER SG1 BUZZER-12MM-KIT 1
8 100 R3 R3 1
9 DS18B20 U3 NONE 1
10 4k7 R4 R3 1
11 7-SEGMENT-4DIGIT-YOUNGSUN LED1 7-SEGMENT-4DIGIT-YOUNGSUN 1
12 1k R5,R6,R7,R8,R9,R10,R11,R12 R3 8
13 B3U-1000P-2P-SMD K1,K2,K3,K4 SW2-SMD-3.0X2.5X1.2+0.4MM 4
14 2k R13 R3 1
15 SDA 5807M U1 NONE 1
16 Encoder U4 NONE 1
17 void B1,B2,B3,B4 NONE 4
18 КП505 Q1,Q2 SOT23 2
19 ATMEGA8-AU U2 TQFP32-08 1
20 AMS1117 U5 ASM1117 1
21 2u2 C1,C2 1206 2
22 LM2576TV-12 U1 314B-05 1
23 IR2104S U2 SO-8 1
24 L7812CV U3 TO220 1
25 IRF3205 Q1,Q2 TO-220AB 2
26 HER108 D1 DO-41 1
27 1N4007 D2 DO-41 1

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