Expected result:

I wanted to place a logo like this one. It is created by exposing the logo copper and filling the empty parts with grid infill copper region.

Actual result:

Method:

the same image (svg) is imported two times

• one is set to top layer
• next is set to soldermask

this gives us the exposed copper logo

Then I placed a rectangular copper region (45 degree grid).
The copper region fills around the image boundary box instead of the actual image shape

Feature requests:

1) The copper region fill algorithm has to be improved

An option has to be added to follow the actual image shape or the image boundary box.

This feature is essential for Easyeda Pro, we deifinitely need better fill algorithm especially for these images.

2) Ideally we want to assign the layer type when an image is imported.

Each svg layer can be assigned to a PCB layer. This will allow us to easily create these type of PCBs using a combination of silkscreen, soldermask and exposed copper

source: https://medium.com/@oshpark/creating-pcb-art-in-kicad-e6441a2bacf9

Available workaround:

Till this feature is implemented, you can use the method suggested by @positron69. See pinned comment below.