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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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STD E/Eprom_prog
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License: Public Domain
Description
Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | FT230XS-R | U8 | SSOP-16_150MIL | 1 |
| 2 | sms240 | U12,U3,U10 | SMS240 | 3 |
| 3 | b4ga012z | RLY? | B4GA012Y | 1 |
| 4 | 680u | C7 | CASE-C_6032 | 1 |
| 5 | COIL10x10 | U11 | COIL1010 | 1 |
| 6 | BC847 | Q2 | SOT-23(SOT-23-3) | 1 |
| 7 | USB | JP1 | USB-MINIB | 1 |
| 8 | M27C256B | U1 | DIP-28_L37.0-W13.8-P2.54-LS15.8-BL | 1 |
| 9 | 0 | R8 | 0603 | 1 |
| 10 | 1k | R11,R10 | 0603 | 2 |
| 11 | 10u | C8 | CASE-B_3528 | 1 |
| 12 | 10u | C6 | 1206 | 1 |
| 13 | ICSP | J1 | HDR-TH_6PIN-V-ROW2-COL3-MALE-PITCH2.54 | 1 |
| 14 | 1k | R9,R3,R13,R12 | 0805 | 4 |
| 15 | 47k | R5 | 0805 | 1 |
| 16 | 10k | R4 | 0805 | 1 |
| 17 | 2k2 | R6,R7 | 0805 | 2 |
| 18 | M24C08-WBN6P | U7 | DIP8 | 1 |
| 19 | PCF8574AT/3,518 | U9 | SOIC-16_16PIN-L10.50-W10.50-PITCH1.27-BL | 1 |
| 20 | 100n | C4 | 0805 | 1 |
| 21 | 10p | C5 | 0603 | 1 |
| 22 | 1u | C14,C18,C17,C16 | 0603 | 4 |
| 23 | LM2575 | U13 | D2PAK-5 | 1 |
| 24 | DCBARREL | CN1 | DCJACK_2MM_SMT | 1 |
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