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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
Std edition esp_sensor
Profile:asda
License: GPL 3.0
sadas
PCB_esp_sensor new
Open in editorPCB_esp_sensor new PLACEMENT v02 copy
Open in editorPCB_esp_sensor new PLACEMENT v02 copy GND Plane
Open in editorPCB_esp_sensor
Open in editorPCB_4esp
Open in editorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 3.3K | 3R0,3R1 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 2 |
2 | 47uF | C1 | CAP-TH_BD6.3-P2.50-D1.0-FD | 1 |
3 | lora | RJ45 | RJ45-TH_FRJ45028-1100K6K0200 | 1 |
4 | ESP32 DEVKIT V1 DOIT | U0,U1,U2,U3 | DOIT-ESP32-DEVKIT-V1 | 4 |
5 | JST-PH_4-PIN_HEADER | U4,U6,U7,U8 | JST_B4B-PH_HEADER | 4 |
6 | IR | IR0,IR1,IR2,IR3,IR4,IR5,IR6,IR7,IR8,IR9,IR10,IR11,IR12,IR13,IR14,IR15,IR16,IR17,IR18,IR19,IR20,IR21,IR22,IR23,IR24,IR25,IR26,IR27,IR28,IR29,IR30,IR31,IR32,IR33,IR34,IR35,IR36,IR37,IR38,IR39,IR40,IR41,IR42,IR43,IR44,IR45,IR46,IR47,IR48,IR49,IR50,IR51,IR52,IR53,IR54,IR55,IR56,IR57,IR58,IR59 | SENSOR-TH_PT333-3B | 60 |
7 | 1M2 | R0,R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R24,R25,R26,R27,R28,R29,R30,R31,R32,R33,R34,R35,R36,R37,R38,R39,R40,R41,R42,R43,R44,R45,R46,R47,R48,R49,R50,R51,R52,R53,R54,R55,R56,R57,R58,R59 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 60 |
8 | 0,1u | C2 | RAD-0.1 | 1 |
9 | 1u | C3 | RAD-0.1 | 1 |
10 | LD-405-200 | LD2 | LASERDIODE_TO18(D5.6)-3 | 1 |
11 | Header-Female-2.54_1x2 | P1 | HDR-1X2/2.54 | 1 |
12 | R4.7K | R61 | R4.7K | 1 |
13 | 240 | R63 | AXIAL-0.3 | 1 |
14 | 100 | R64 | RES-ADJ_3386P | 1 |
15 | LM350T/NOPB | U9 | TO-220(TO-220-3) | 1 |
16 | 16.5*16*25 2个钉散热板 | U10 | HEATSINK-TH_L16.5-W16.0-P10.00-D1.5 | 1 |
17 | DS18B20 | U11 | DS18B20 | 1 |
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