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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
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Description
PIC16F73
Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | PIC16F73-I/SP | U1 | DIP-28_300MIL | 1 |
| 2 | ULN2003AIN | U2 | PDIP-16_L22.1-W6.3-P2.54-LS7.6-BL | 1 |
| 3 | 4MHZ | X1 | XTAL-TH_2PIN-L11.05-W4.65-PITCH4.88 | 1 |
| 4 | 1u | C3 | CAP-D3.0XF1.5 | 1 |
| 5 | L7805ABV | U3 | TO-220(TO-220-3) | 1 |
| 6 | 1u | C4 | RAD-0.1 | 1 |
| 7 | RelayHT3F-12VDC-SHG | K1 | RELAY-TH_5PIN_HT3F-12VDC-SHG | 1 |
| 8 | 100 | R2,R4,R5 | RES-ADJ_3386P | 3 |
| 9 | 4-POS-DIP | U5 | 4-POS-DIP-SMD | 1 |
| 10 | 15pF | C1,C2,C5,C6,C7 | CAP-TH_L8.5-W5.0-P5.00-D1.2 | 5 |
| 11 | 1k | R1,R3,R6,R7,R8,R9 | AXIAL-0.3 | 6 |
| 12 | 470 | RN1 | RES-ARRAY-TH_9PIN-L22.82-W3.00-PITCH2.54 | 1 |
| 13 | KA7812B | U4 | TO-220-3_L10.0-W4.5-P2.54-L | 1 |
| 14 | LED-3MM | LED1 | LED-3MM/2.54 | 1 |
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