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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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STD EAN100_PART2
Profile：Bb
License: Public Domain
Description
Bb
Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part | BOM_JLCPCB Part Class |
|---|---|---|---|---|---|---|---|---|---|
| 1 | 100uF | C8,C9,C10,C11 | CAP-TH_BD8.0-P3.50-D0.6-FD | 4 | LCSC | C233109 | Jianghai(南通江海) | ECR1JBK101MLL080011 | Extended Part |
| 2 | EAN1 | CN1 | CONN-TH_3P-P5.08_DB2ER-5.08-3P | 1 | LCSC | C395739 | DIBO(地博电气) | DB2ER-5.08-3P-GN | Extended Part |
| 3 | EAN2 | CN2 | CONN-TH_3P-P5.08_DB2ER-5.08-3P | 1 | LCSC | C395739 | DIBO(地博电气) | DB2ER-5.08-3P-GN | Extended Part |
| 4 | EAN3 | CN3 | CONN-TH_3P-P5.08_DB2ER-5.08-3P | 1 | LCSC | C395739 | DIBO(地博电气) | DB2ER-5.08-3P-GN | Extended Part |
| 5 | EAN4 | CN4 | CONN-TH_3P-P5.08_DB2ER-5.08-3P | 1 | LCSC | C395739 | DIBO(地博电气) | DB2ER-5.08-3P-GN | Extended Part |
| 6 | PZ254R-11-06P | H1 | HDR-TH_6P-P2.54-H-M-W10.4 | 1 | LCSC | C492414 | XFCN | PZ254R-11-06P | Extended Part |
| 7 | 10kΩ | R9,R10,R11,R12 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 4 | LCSC | C410695 | Tyohm(幸亚电阻) | RN 1/4W 10K F T/B A1 | Extended Part |
| 8 | LM358GN | U1,U2 | DIP-8_L9.8-W6.6-P2.54-LS7.6-BL | 2 | LCSC | C2902318 | HTC | LM358GN | Extended Part |
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