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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD Converter COM -ETHernet
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | MAX3232 | U2 | SOIC-16_150mil | 1 |
| 2 | 16.5888MHz | TXAL1 | TXAL-3*8 | 1 |
| 3 | ATMEGA128 | U1 | TQFP-64_14X14X08P | 1 |
| 4 | SPI-Com1 | 2X5 | HDR-5X2/2.54 | 1 |
| 5 | LM7805L | U3 | TO-220(TO-220-3) | 1 |
| 6 | DB9() | JP1 | DB9 | 1 |
| 7 | DB9 | JP2 | DB9_MALE | 1 |
| 8 | 10KΩ | R1 | AXIAL-1.0 | 1 |
| 9 | 1N5821 | D1 | DO-201AD | 1 |
| 10 | 22uF | C1,C2 | RAD-0.1 | 2 |
| 11 | 470 | R2 | AXIAL-0.3 | 1 |
| 12 | GNL-5013HD | LED1 | LED-3MM/2.54 | 1 |
| 13 | 0,1uF | C3,C4,C5 | RAD-0.1 | 3 |
| 14 | 10k | R3 | AXIAL-0.3 | 1 |
| 15 | 1uF | C6,C7,C8,C9 | RAD-0.1 | 4 |
| 16 | 10K | R4 | AXIAL-0.3 | 1 |
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