© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD Temperature_Sensor
Mode:
A sensor board that communicates with an MLX infrared temperature sensor and transmits the data into a CAN BUS network.
ID | Name | Designator | Footprint | Quantity | BOM_Manufacturer Part | BOM_Manufacturer | BOM_Supplier Part |
---|---|---|---|---|---|---|---|
1 | 22pF | C1,C2,C3,C4 | C0603 | 4 | CL10C220JB8NNNC | SAMSUNG(三星) | C1653 |
2 | 1uF | C5,C7 | C0603 | 2 | CL10A105KB8NNNC | SAMSUNG(三星) | C15849 |
3 | 22nF | C6 | C0603 | 1 | CL10B223KB8NNNC | SAMSUNG | C21122 |
4 | 100nF | C9,C10,C11,C12 | C0603 | 4 | CL10B104KB8NNNC | SAMSUNG(三星) | C1591 |
5 | HDGC2001WR-S-4P | CN1 | CONN-SMD_4P-P2.00_HDGC_HDGC2001WR-S-4P | 1 | HDGC2001WR-S-4P | HDGC(华德共创) | C2936226 |
6 | NDC7002N_C404322 | Q1 | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BL | 1 | NDC7002N | Youtai Semiconductor Co., Ltd. | C404322 |
7 | 10K | R1,R2 | R0603 | 2 | RC0603FR-0710KL | YAGEO(国巨) | C98220 |
8 | 4.7K | R3,R4,R5,R6 | R0603 | 4 | RC0603FR-074K7L | YAGEO(国巨) | C99782 |
9 | MCP2515-I/ST | U1 | TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL | 1 | MCP2515-I/ST | MICROCHIP | C15193 |
10 | MCP2551T-I/SN | U2 | SOIC-8_L5.0-W4.0-P1.27-LS6.0-BL | 1 | MCP2551T-I/SN | MICROCHIP(美国微芯) | C49558 |
11 | ATMEGA328PB-AU | U3 | TQFP-32_L7.0-W7.0-P0.80-LS9.0-BL | 1 | ATMEGA328PB-AU | MICROCHIP(美国微芯) | C132230 |
12 | MLX90621 | U4 | TO-46-4 | 1 | MLX90615SSG-DAA-000-TU | Melexis | C93959 |
13 | RT9193-33GB | U5 | SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BR | 1 | RT9193-33GB | RICHTEK(立锜) | C15651 |
14 | 16MHz | X1 | OSC-SMD_L5.0-W3.2 | 1 | X503216MSB2GI | YXC(扬兴晶振) | C112572 |
15 | 8MHz | X2 | CRYSTAL-SMD_L5.0-W3.2 | 1 | X50328MSB2GI | YXC(扬兴晶振) | C115962 |
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