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STD Temperature_Sensor
Temperature_Sensor
License
GPL 3.0
License: GPL 3.0Mode:
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Update time：
2023-03-23 08:37:06
Creation time：
2022-12-10 02:19:08
Description
Description
A sensor board that communicates with an MLX infrared temperature sensor and transmits the data into a CAN BUS network.
Design Drawing
Design Drawing
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| ID | Name | Designator | Footprint | Quantity | BOM_Manufacturer Part | BOM_Manufacturer | BOM_Supplier Part |
|---|---|---|---|---|---|---|---|
| 1 | 22pF | C1,C2,C3,C4 | C0603 | 4 | CL10C220JB8NNNC | SAMSUNG(三星) | C1653 |
| 2 | 1uF | C5,C7 | C0603 | 2 | CL10A105KB8NNNC | SAMSUNG(三星) | C15849 |
| 3 | 22nF | C6 | C0603 | 1 | CL10B223KB8NNNC | SAMSUNG | C21122 |
| 4 | 100nF | C9,C10,C11,C12 | C0603 | 4 | CL10B104KB8NNNC | SAMSUNG(三星) | C1591 |
| 5 | HDGC2001WR-S-4P | CN1 | CONN-SMD_4P-P2.00_HDGC_HDGC2001WR-S-4P | 1 | HDGC2001WR-S-4P | HDGC(华德共创) | C2936226 |
| 6 | NDC7002N_C404322 | Q1 | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BL | 1 | NDC7002N | Youtai Semiconductor Co., Ltd. | C404322 |
| 7 | 10K | R1,R2 | R0603 | 2 | RC0603FR-0710KL | YAGEO(国巨) | C98220 |
| 8 | 4.7K | R3,R4,R5,R6 | R0603 | 4 | RC0603FR-074K7L | YAGEO(国巨) | C99782 |
| 9 | MCP2515-I/ST | U1 | TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL | 1 | MCP2515-I/ST | MICROCHIP | C15193 |
| 10 | MCP2551T-I/SN | U2 | SOIC-8_L5.0-W4.0-P1.27-LS6.0-BL | 1 | MCP2551T-I/SN | MICROCHIP(美国微芯) | C49558 |
| 11 | ATMEGA328PB-AU | U3 | TQFP-32_L7.0-W7.0-P0.80-LS9.0-BL | 1 | ATMEGA328PB-AU | MICROCHIP(美国微芯) | C132230 |
| 12 | MLX90621 | U4 | TO-46-4 | 1 | MLX90615SSG-DAA-000-TU | Melexis | C93959 |
| 13 | RT9193-33GB | U5 | SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BR | 1 | RT9193-33GB | RICHTEK(立锜) | C15651 |
| 14 | 16MHz | X1 | OSC-SMD_L5.0-W3.2 | 1 | X503216MSB2GI | YXC(扬兴晶振) | C112572 |
| 15 | 8MHz | X2 | CRYSTAL-SMD_L5.0-W3.2 | 1 | X50328MSB2GI | YXC(扬兴晶振) | C115962 |
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