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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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Std Edition13402-1.3.6-pcb
Profile：1.3.6-pcb
Description
1.3.6-pcb
Documents
| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 2N2222 | Q2 | TO-92-3_L4.9-W3.7-P1.27-L | 1 |
| 2 | 1u | C1,C2 | RAD-0.1 | 2 |
| 3 | 27u | CE | RAD-0.1 | 1 |
| 4 | 1K | RS,RL | AXIAL-0.3 | 2 |
| 5 | 9K | R1 | AXIAL-0.3 | 1 |
| 6 | 22K | R2 | AXIAL-0.3 | 1 |
| 7 | 5K | RC | AXIAL-0.3 | 1 |
| 8 | 1K5 | RE | AXIAL-0.3 | 1 |
| 9 | SIN(0 20m 5k 0 0 0) | V1 | HDR1X2 | 1 |
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