© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD Smd to DIP breakout adapter
Mode:
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part |
---|---|---|---|---|---|---|---|---|
1 | Header-Male-2.54_1x4 | H2,H3,H4,H5 | DIP-1X4P-2.54MM-M | 4 | LCSC | Ckmtw | 210S-1*4P L=11.6MMGold-plated black | C124378 |
2 | Header-Male-2.54_1x5 | H1 | HDR-TH_5P-P2.54-V | 1 | LCSC | Ckmtw | 210S-1*5P L=11.6MMGold-plated black | C124379 |
3 | Header-Male-2.54_1x5 | H6,H7 | DIP-1X5P-2.54MM-M | 2 | LCSC | Ckmtw | 210S-1*5P L=11.6MMGold-plated black | C124379 |
4 | ATTINY85-20SU | U4 | ATTINY85-20SU-SOIC-8 | 1 | LCSC | MICROCHIP | ATTINY85-20SU | C89852 |
5 | LT3083EQ#PBF | U2 | DD-PAK-5_L10.6-W10.3-P1.70-LS14.5-BR | 1 | LCSC | Linear Tech | LT3083EQ#PBF | C459910 |
6 | ADP1613ARMZ-R7 | U1 | MSOP-8 | 1 | LCSC | ADI | ADP1613ARMZ-R7 | C132279 |
7 | NCP5623 | U3 | TSSOP-14 | 1 | Mouser | ON Semiconductor | NCP5623DTBR2G | 863-NCP5623DTBR2G |
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