© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD Portable Soldering Iron
Mode:
Compoment Separation
Open in EditorPCB (50mm*100mm)
Open in EditorPanalized PCB (100*100)mm
Open in EditorFor half space in double 86 box
Open in Editor49*49
Open in EditorFor half space in double 86 box copy
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | IRF4905 | Q1 | TO-220AB | 1 |
2 | Headers_Pins2.54 | P1 | HDR-2.54-1X13P | 1 |
3 | 1M | R7 | AXIAL-0.4 | 1 |
4 | 2k | R10,R9 | AXIAL-0.4 | 2 |
5 | 10k | R3,R1,R6,R8 | AXIAL-0.4 | 4 |
6 | 1k | R4,R2 | AXIAL-0.4 | 2 |
7 | 200k | R5 | AXIAL-0.4 | 1 |
8 | 1mF | C7 | CAP-D8.0XF3.5 | 1 |
9 | compact 360 buck convertor | U4 | SUPER COMPACT 360 BUCK CONVERTOR PACKAGE | 1 |
10 | vibrate sensor | S1 | VIBRATE SENSOR | 1 |
11 | ATmega328-PU | U3 | DIP28 | 1 |
12 | 4PIN | U2 | PIN4 | 1 |
13 | button6*6*8 | KEY1,KEY2 | KEY-TH_4P-L6.0-W6.0-P4.50-LS7.5 | 2 |
14 | 22nF | C8 | RAD-0.1 | 1 |
15 | 10nF | C6,C5 | RAD-0.1 | 2 |
16 | 100nF | C3,C2,C4 | RAD-0.1 | 3 |
17 | 2N3904 | Q2 | TO-92-3_L5.1-W4.1-P1.27-L | 1 |
18 | 1N5819-B | D1 | DO41-7.6 | 1 |
19 | Output Screw | J2 | H2-3.5-7.0X7.0MM | 1 |
20 | INPUT Screw | J1 | H2-3.5-7.0X7.0MM | 1 |
21 | 2.2nF | C1 | RAD-0.1 | 1 |
22 | CRYSTAL_16MHz | Y1 | HC49U-V | 1 |
23 | HA17358B | U1 | DIP-8 | 1 |
Unfold
Loading...
Do you need to add this project to the album?