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Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD Hydroponic_System
Mode:
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | relayB | RELAY | RELAYB | 1 |
2 | SHT30 Module | TH | SHT30 MODULE | 1 |
3 | BH1750 GY-302 | LI | BH1750_01 | 1 |
4 | WF | WF1 | HDR-3X1/2.54 | 1 |
5 | 2.1MMJACKTHM | JACK | PJ-102A | 1 |
6 | LD1117V33 | LD1117V1 | TO-220(TO-220-3) | 1 |
7 | 100n | C1 | CAP-D5.0XF2.0 | 1 |
8 | 10u | C2 | CAP-D5.0XF2.0 | 1 |
9 | MEGAARDUINO_11 | MEGA | MEGA_ARDUINO_1 | 1 |
10 | sim900a | GSM | SIM900A | 1 |
11 | DS3231 | RTC | DS3231 MODULE_MY | 1 |
12 | Header-Male-2.54_1x1 | BUCK1,BUCK3,BUCK2,BUCK4 | HDR-1X1/2.54 | 4 |
13 | MAX6675_Shield | TEMPW | MAX6675 SHIELD | 1 |
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