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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
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Std EditionESP8266_micromodule
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | IRF7821TRPBF | U6,U8,U7,U5 | SOIC-8_L5.0-W4.0-P1.27-LS6.0-BL | 4 |
2 | 10K | R1,R3,R4 | R0402 | 3 |
3 | 220uF | C7 | CAP-SMD_BD6.3-L6.6-W6.6-FD | 1 |
4 | BSS138 | Q1 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 1 |
5 | PADS 1X4 10mm | P2 | OVAL PADS 1X4 10MM | 1 |
6 | B260AQ-13-F | D3 | SMA_L4.3-W2.6-LS5.2-RD | 1 |
7 | ANTENNA | ANT1 | RN-ANT | 1 |
8 | 15uF | C8 | CAP-SMD_L6.0-W3.2-R-RD | 1 |
9 | 12nH | L2,L1 | L0402 | 2 |
10 | 5.6pF | C4 | C0402 | 1 |
11 | 26MHz | X1 | OSC-SMD_4P-L3.2-W2.5-BL | 1 |
12 | 10pF | C5,C6 | C0402 | 2 |
13 | 1uF | C1 | C0603 | 1 |
14 | MIC4680-3.3YM-TR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 |
15 | 12K | R2 | R0402 | 1 |
16 | 100nF | C3,C2 | C0402 | 2 |
17 | 2.4GHz | U3 | QFN-32_L5.0-W5.0-P0.50-BL-EP3.7 | 1 |
18 | PADS 1X1 10mm | P6,P3,P4 | OVAL PADS 1X1 10MM (4) | 3 |
19 | 68uH | L3 | IND-SMD_L3.5-W3.0 | 1 |
20 | PADS 1X3 10mm R | P1 | OVAL PADS 1X3 10MM | 1 |
21 | testpoint | GND,TX,GPIO4,BOOT,RST,RX | TESTPOINT 1MM | 6 |
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