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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD Bluetooth Keyless

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Update time: 2021-06-19 07:03:32
Creation time: 2020-12-19 21:49:19
Description

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Design Drawing
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ID Name Designator Footprint Quantity
1 2200uF C5 CAP-D13XF5.0 1
2 PIS4720 L1 PIS4720 1
3 M7 D2,D3,D4,D5,D6,D7,D8,D9,D10,D11 SMA(DO-214AC) 10
4 PMBT2222A Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8,Q9,Q10 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 10
5 LM2596SX-ADJ/NOPB U2 TO-263-5_L10.2-W9.9-P1.70-LS14.4-TL 1
6 100nF C3,C4 C1206 2
7 HK19F-DC12V-SHG K2,K8,K3 RELAY-TH_HK19F-XXXX-XXX 3
8 CMA51H-S-DC12V-C K4,K5,K6,K7 RELAY-TH_CMA51H-S-DCXX-C 4
9 PINHD-1X9 JP2 1X09-BIG 1
10 PINHD-1X8-3.5MM JP1 1X08-3.5MM 1
11 BlueLED LED1 LED-0805 1
12 GreenLED LED2 LED-0805 1
13 PIN_3X1 U3 PIN_3X1 1
14 CC2541PA2S U1 CC2541PA2S 1
15 330Ω R1 R0805 1
16 1,0KΩ R2 R0805 1
17 220Ω R3,R4,R5,R6,R7,R8,R9,R10,R11,R12 R0805 10
18 3,3KΩ R13 R0805 1
19 56,4KΩ R14 R0805 1
20 8,5KΩ R15 R0805 1
21 74,6KΩ R16 R0805 1
22 10KΩ R17 R0805 1
23 590Ω R18 R0805 1
24 SS34 D1 DO214AB 1
25 220uF C1,C2 CAP-SMD_BD8.0-L8.3-W8.3-FD 2
26 Header-Female-2.54_1x6 P1 HDR-TH_6P-P2.54-V-F 1

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