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Standard
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD TDA2003 Bridged Amplifier
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Description
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Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | TDA2003 | U1,U6 | TDA2003 | 2 |
| 2 | 2.2 uF | C1 | PANASONIC 2.2 UF FILM | 1 |
| 3 | 100 nF | C3,C6,C9,C11 | 100 NF WIMA MKP | 4 |
| 4 | 100 uF | C7,C10 | 100 UF 25V PANASONIC FC | 2 |
| 5 | 15 uF | C2 | 15 UF PANASONIC FC | 1 |
| 6 | 10 uF | C4 | 10 UF PANASONIC FC | 1 |
| 7 | 16R | R1,R5 | R3 | 2 |
| 8 | 200R | R2 | R3 | 1 |
| 9 | 430R | R3 | R3 | 1 |
| 10 | 1R, 1W | R4 | R3 | 1 |
| 11 | 47 nF | C5 | 47 NF XICON POLYSTYRENE | 1 |
| 12 | 10R | R6 | R3 | 1 |
| 13 | 8 | SPEAKER | 1X02 | 1 |
| 14 | 2.2 uF | C8 | 47 NF XICON POLYSTYRENE | 1 |
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