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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 30,000 devices or 100,000 pads

3.More rigorous design constraints, more standardized processes

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Std Edition16 ch r module 2

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Published Time:2018-01-09 17:12:36
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1 Schematic

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ID Name Designator Footprint Quantity
1 SRD-05VDC-SL-C RELAY1,RELAY2,RELAY3,RELAY4,RELAY5,RELAY6,RELAY7,RELAY8 RELAY-SL-SRD 8
2 SS34 D1 SMA(DO-214AC) 1
3 JC817C U1,U2,U3,U4,U5,U6,U7,U9 DIP-4 8
4 1k R1,R3,R5,R7,R9,R11,R13,R15 0805 8
5 3AR2PD08 LED1,LED2,LED3,LED4,LED5,LED6,LED7,LED8 LED-3MM 8
6 WJ500V-5.08-2P P1 WJ500V-5.08-2P 1
7 WJ301V-5.00-3P P2,P3,P4,P5,P6,P7,P8,P9 WJ301V-5.00-3P 8
8 10k R2,R4,R6,R8,R10,R12,R14,R16 0805 8
9 Header-Male-1.27_2x10 P10 HDR-10X2/1.27 1
10 2k R17,R18,R19,R20,R21,R23,R24,R25 1206 8

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