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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD Lucifer

Lucifer

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Update time: 2020-12-15 07:59:10
Creation time: 2020-03-13 17:47:27
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ID Name Designator Footprint Quantity
1 SS14FL_C118876 D1 SOD-123F_L2.8-W1.8-LS3.7-RD 1
2 NCV8161ASN280T1G U1 TSOP-5_L3.0-W1.5-P0.95-LS2.8-BL 1
3 100uF C6 C1206 1
4 solderPad GPIO0_1,EN/RST_1,GPIO0_2,EN/RST_2 SOLDERPAD 4
5 470 R5,R6 R1218 2
6 100nF C2 C0603 1
7 22uH L1 IND-SMD_L12.9-W9.8 1
8 1uF C5 C0805 1
9 20K R2 R2512 1
10 LMR14010ADDCR U2 SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BL 1
11 10uF C4,C3,C1 C1210 3
12 70AAJ-5-M0G J1,J2,J3 70AAJ-5-M0G 3
13 12K R3,R4 R0805 2
14 SolderPad VDD1,GND1,DIN1,DOUT1,VDD2,GND2,DIN2,DOUT2,VDD3,GND3,DIN3 SOLDER_PAD 11
15 110K R1 R2512 1
16 ESP-WROOM-32 U3 WIFIM-SMD_ESP-WROOM-32 1
17 Header-Female-2.54_1x6 P1 HDR-TH_6P-P2.54-V 1

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