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Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
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The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD MCP2210 Breakout Board (SSOP-20)
Mode:
origin : Mohit Mohan (https://easyeda.com/mht.mhn/mcp2210-spi-bridge)
I edit some parts list (using JLCPCB SMT Assembly Basic Part , except the USB interface.)
(In addition, since I plan to solder the connector myself, it is not on the BOM list of JLCPCB.)
and change MCP2210 Package to TSSOP-28.
In PCB side... build panelization for JLCPCB.
After panelization... You can get 9pcs Breakout Board per PCB but also in 2$.
(So... 5 PCB can totally get 45pcs breakout board!)
After several days of waiting,
I received the assembled PCB and tested it to confirm that the function is normal !
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part |
---|---|---|---|---|---|---|---|
1 | 12MHz | X1 | OSC-SMD_4P-L3.2-W2.5-BL | 1 | LCSC | YXC | X322512MSB4SI |
2 | MCP2210-I/SS | U1 | SSOP-20_L7.2-W5.3-P0.65-LS7.8-BL | 1 | LCSC | MICROCHIP(美国微芯) | MCP2210-I/SS |
3 | 100nF | C3,C4 | C0603 | 2 | LCSC | YAGEO | CC0603KRX7R9BB104 |
4 | 12pF | C1,C2 | C0603 | 2 | LCSC | SAMSUNG | CL10C120JB8NNNC |
5 | 2.54mm | H1,H2 | 210S-1X6P | 2 | LCSC | Ckmtw | 210S-1*6P L=11.6MMGold-plated black |
6 | 470nF | C5,C6 | C0603 | 2 | LCSC | SAMSUNG | CL10B474KA8NNNC |
7 | 2.54mm | H3 | HDR-TH_5P-P2.54-V | 1 | LCSC | MINTRON | MTF185-105SY1 |
8 | 390 | R1 | R0603 | 1 | LCSC | UniOhm | 0603WAF3900T5E |
9 | Micro B | USB1 | MICRO-USB-SMD_MICRO-USB-18 | 1 | LCSC | HRO | U-F-M5DD-W-L |
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