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2.The process supports design scales of 300 devices or 1000 pads
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
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Std Edition6 input 16 output expander
Profile：IDK
License: GPL 3.0
Description
mutually exclusive expander
Documents
| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
|---|---|---|---|---|---|---|---|---|
| 1 | X6521WVS-2X08H-C60D74 | H1 | HDR-SMD_16P-P2.54-V-M-R2-C8-S7.4 | 1 | LCSC | C2884017 | XKB Connectivity(中国星坤) | X6521WVS-2x08H-C60D74 |
| 2 | KBC81740C | Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8,Q9,Q10,Q11,Q12,Q13,Q14,Q15,Q16,Q25,Q26,Q27,Q28 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 20 | LCSC | C379927 | Kodenshi AUK | KBC81740C |
| 3 | BC846SF | Q17,Q18,Q19,Q20,Q21,Q22,Q23,Q24 | SC-88-6_L2.0-W1.3-P0.65-LS2.1-BL | 8 | LCSC | C549465 | Nexperia | BC846SF |
| 4 | 1kΩ | R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R24,R25,R26,R27,R28,R29,R30,R31,R32,R33,R34,R35,R36 | R0201 | 36 | LCSC | C305277 | Huaxin S&T | WR02X1001FALV |
| 5 | 10Ω | R37,R38,R39,R40 | R0805 | 4 | LCSC | C724882 | Viking Tech | AR05BTBW0100 |
| 6 | SN74HC21QPWRG4Q1 | U1,U2,U3,U4,U5,U6,U7,U8 | TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL | 8 | LCSC | C2864275 | TI(德州仪器) | SN74HC21QPWRG4Q1 |
| 7 | 74HCT1G04GV,125 | U9,U10,U11,U12,U13,U14,U15,U16,U17,U18,U19,U20,U21,U22,U23,U24,U25,U26,U27,U28,U29,U30,U31,U32 | SOT-753_L3.1-W1.7-P0.95-LS3.0-BL | 24 | LCSC | C12503 | Nexperia | 74HCT1G04GV,125 |
| 8 | MC74HC08ADTR2G | U33,U34,U35,U36 | TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL | 4 | LCSC | C154816 | ON | MC74HC08ADTR2G |
| 9 | LM2931AD-5.0R2G | U37 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | C134292 | ON Semicon | LM2931AD-5.0R2G |
| 10 | X1321WV-2X04J-C30D23 | U38 | HDR-TH_8P-P1.27-V-M-R2-C4-S1.27 | 1 | LCSC | C2881786 | XKB Connectivity(中国星坤) | X1321WV-2x04J-C30D23 |
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