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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD 2019 PROJET ELECTRONIQUE

2019 PROJET ELECTRONIQUE

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Update time: 2023-05-30 22:38:00
Creation time: 2019-12-04 13:26:31
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ID Name Designator Footprint Quantity
1 HMB1275-12B BUZZER1 BUZ-TH_BD12.0-P7.60-D0.6-FD 1
2 100u C1 CAP-D8.0XF3.5 1
3 100nF C2 RAD-0.1 1
4 LED-3MM D1,D2,D3,D4,D5,D6,D7,D8,D9,D10,D11 LED-3MM/2.54 11
5 204-10SYGD/S530-E3 D12,D13,D14,D15,D16,D17,D18,D19 LED-TH_BD3.8-P2.54-FD 8
6 1N4148 D20,D21,D22,D23,D24,D25,D26,D27 DO-35 8
7 1N4148 D28,D29,D30,D31,D32,D33,D34,D35 DO-35_BD2.0-L4.0-P8.00-D0.5-FD 8
8 Header-Male-2.54_1x5 G3 DIP-1X5P-2.54MM-M 1
9 Header-Male-2.54_1x2 PILE HDR-2X1/2.54 1
10 10KOHM-1_4W5%(PTH)HORIZ-KIT R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R-SW1 AXIAL-0.3EZ 11
11 DS1128-02-S80B RJ45,RJ45-G1 DS1128-02-S80B 2
12 TS-1102-5016 SW1 SW-TH_4P-L6.0-W6.0-P3.90-LS6.5 1
13 16F628AP U1 DIP18 1

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