© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD ESP8266 Test
test
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | G3MB-202PL | K1,K2,K3 | RELAY-TH_G3MB-202PL | 3 | LCSC | OMRON(欧姆龙) | G3MB-202PL | C48654 | Extended Part |
2 | O1 | U1 | CONN-TH_2P-P5.00_DB301V-5.0-2P-BU-P | 1 | LCSC | DIBO(地博电气) | DB301V-5.0-2P-BU-P | C430621 | Extended Part |
3 | O2 | U2 | CONN-TH_2P-P5.00_DB301V-5.0-2P-BU-P | 1 | LCSC | DIBO(地博电气) | DB301V-5.0-2P-BU-P | C430621 | Extended Part |
4 | =3 | U3 | CONN-TH_2P-P5.00_DB301V-5.0-2P-BU-P | 1 | LCSC | DIBO(地博电气) | DB301V-5.0-2P-BU-P | C430621 | Extended Part |
5 | 230V | U4 | CONN-TH_2P-P5.00_DB301V-5.0-2P-BU-P | 1 | LCSC | DIBO(地博电气) | DB301V-5.0-2P-BU-P | C430621 | Extended Part |
6 | HLK-PM01 | U5 | PWRM-TH_HLK-PM01 | 1 | LCSC | HI-LINK | HLK-PM01 | C209903 | Extended Part |
7 | 2.4GHz | U6 | WIFIM-SMD_ESP-12F-ESP8266MOD | 1 | LCSC | Ai-Thinker(安信可) | ESP-12F(ESP8266MOD) | C82891 | Extended Part |
8 | AMS1117-3.3_C347222 | U7 | SOT-223-4_L6.5-W3.5-P2.30-LS7.0-BR | 1 | LCSC | UMW(广东友台半导体) | AMS1117-3.3 | C347222 | Extended Part |
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