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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
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ID | Name | Designator | Footprint | Quantity | BOM_Manufacturer Part |
---|---|---|---|---|---|
1 | NE555N | U1,U2 | DIP-8_L9.8-W6.6-P2.54-LS7.6-BL | 2 | NE555N |
2 | LED | U3,U4,U5,U6,U7,U8,U9,U10 | 5MM LED | 8 | 5mm LED |
3 | 1M | R1,R3 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 2 | RN 1/4W 10K F T/B A1 |
4 | 1uF | C1 | CAP-TH_BD5.0-P2.00-D0.8-FD | 1 | 10uF 25V 5*11 |
5 | 220R | R2 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 | RN 1/4W 10K F T/B A1 |
6 | 100nF | C2 | RAD-0.2 | 1 | 0.1UF(104) +-20% 63v |
7 | 220uF | C3 | CAP-TH_BD8.0-P3.50-D1.0-FD | 1 | 220uF 25V 8*12 |
8 | 100uF | C4 | CAP-TH_BD8.0-P3.50-D1.0-FD | 1 | 220uF 25V 8*12 |
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