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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads
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STD max6675
Project Status:
Ongoing
License: Public Domain
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Description
max6675 thermocouple pcb (not yet test)
Design Drawing
schematic diagram
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PCB
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| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
|---|---|---|---|---|---|---|---|---|
| 1 | 100nF | C1 | C0805 | 1 | LCSC | C187860 | Holy Stone Enterprise | C0603X104K050T |
| 2 | K-TERMOCOUPLE | CN1 | KF301 | 1 | LCSC | C46028 | Ningbo Kangnex Elec | - |
| 3 | 1N4148 | D1 | SOD123 | 1 | LCSC | C14516 | SEMTECH | 1N4148 |
| 4 | CONNECTOR | H1 | HDR-M-2.54_1X5 | 1 | LCSC | C124414 | Ckmtw | 220S-1*5P H=8.5MM Ytype Gold-plated |
| 5 | 3MM | LED1 | LED0603 | 1 | LCSC | C85161 | EVERLIGHT | 204-10SYGD/S530-E3 |
| 6 | 330 | R1 | R0805 | 1 | LCSC | C103547 | RALEC | RTT03330JTP |
| 7 | MAX6675ISA+T | U1 | SOP8-1.27-5X3.6MM | 1 | LCSC | C16030 | MAXIM | MAX6675ISA+T |
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