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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2019-06-19 04:39:25
Creation time: 2019-06-16 10:17:46
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ID Name Designator Footprint Quantity
1 10k R1 AXIAL-0.3 1
2 1k R2,R3 AXIAL-0.3 2
3 1.4k R4 AXIAL-0.3 1
4 2.2k R5 AXIAL-0.3 1
5 470uF C1 RAD-0.1 1
6 100uH L1 AXIAL-0.4 1
7 EVQ22705R SW1,SW2 KEY-6.0*6.0-4 2
8 1N4007 D1 DO-35 1
9 TIP122 Q1,Q2 TO-220(TO-220-3) 2
10 ARDUINOUNO U1 ARDUINO 1
11 LCD-16X2NOHOLES U2 LCD-16X2_NOHOLES 1
12 10k R6 RES-ADJ_3296W 1
13 BULB H1 IND2-N10 1
14 Header-Male-2.54_1x2 H2 HDR-2X1/2.54 1

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