© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD BMS_test_board
Mode:
AER BMS project
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | CL4532A-201_C2904734 | L1,L2 | FILTER-SMD_8P-L4.5-W3.2_CL4532A-201 | 2 | LCSC | C2904734 | Mentech(铭普光磁) | CL4532A-201 | Extended Part |
2 | 100kΩ | R2,R3,R4,R5,R6 | R0402 | 5 | LCSC | C25741 | UniOhm | 0402WGF1003TCE | Basic Part |
3 | 47Ω | R7 | R0603 | 1 | LCSC | C23182 | UNI-ROYAL(厚声) | 0603WAF470JT5E | Basic Part |
4 | MC33771BTA1AE | U2 | LQFP-64_L10.0-W10.0-P0.50-LS12.0-BL-EP5.3 | 1 | LCSC | C432306 | NXP(恩智浦) | MC33771BTA1AE | Extended Part |
5 | MC33664ATL1EGR2 | U3 | SO-16_L10.0-W4.0-P1.27-LS6.2-BL | 1 | LCSC | C727898 | NXP Semicon | MC33664ATL1EGR2 | Extended Part |
6 | 100nF | C1,C7,C2,C4,C5,C6,C10 | C0402 | 7 | LCSC | C307331 | Samsung Electro-Mechanics | CL05B104KB54PNC | Basic Part |
7 | 10nF | C3 | C0402 | 1 | LCSC | C15195 | SAMSUNG | CL05B103KB5NNNC | Basic Part |
8 | 4.7uF | C8 | C0402 | 1 | LCSC | C23733 | SAMSUNG(三星) | CL05A475MP5NRNC | Basic Part |
9 | 1nF | C9 | C0603 | 1 | LCSC | C1588 | SAMSUNG(三星) | CL10B102KB8NNNC | Basic Part |
10 | 10kΩ | R1 | R0402 | 1 | LCSC | C25744 | UniOhm | 0402WGF1002TCE | Basic Part |
11 | TK-6580-2 | SW1 | SW-TH_TK-6580-2 | 1 | LCSC | C528779 | Yuandi(台湾元迪) | TK-6580-2 | Extended Part |
12 | GD32E103C8T6 | U1 | LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL | 1 | LCSC | C350804 | GigaDevice Semicon Beijing | GD32E103C8T6 | Extended Part |
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