© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD BMS_test_board
Mode:
AER BMS project
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part | BOM_JLCPCB Part Class |
---|---|---|---|---|---|---|---|---|---|
1 | CL4532A-201_C2904734 | L1,L2 | FILTER-SMD_8P-L4.5-W3.2_CL4532A-201 | 2 | LCSC | C2904734 | Mentech(铭普光磁) | CL4532A-201 | Extended Part |
2 | 100kΩ | R2,R3,R4,R5,R6 | R0402 | 5 | LCSC | C25741 | UniOhm | 0402WGF1003TCE | Basic Part |
3 | 47Ω | R7 | R0603 | 1 | LCSC | C23182 | UNI-ROYAL(厚声) | 0603WAF470JT5E | Basic Part |
4 | MC33771BTA1AE | U2 | LQFP-64_L10.0-W10.0-P0.50-LS12.0-BL-EP5.3 | 1 | LCSC | C432306 | NXP(恩智浦) | MC33771BTA1AE | Extended Part |
5 | MC33664ATL1EGR2 | U3 | SO-16_L10.0-W4.0-P1.27-LS6.2-BL | 1 | LCSC | C727898 | NXP Semicon | MC33664ATL1EGR2 | Extended Part |
6 | 100nF | C1,C7,C2,C4,C5,C6,C10 | C0402 | 7 | LCSC | C307331 | Samsung Electro-Mechanics | CL05B104KB54PNC | Basic Part |
7 | 10nF | C3 | C0402 | 1 | LCSC | C15195 | SAMSUNG | CL05B103KB5NNNC | Basic Part |
8 | 4.7uF | C8 | C0402 | 1 | LCSC | C23733 | SAMSUNG(三星) | CL05A475MP5NRNC | Basic Part |
9 | 1nF | C9 | C0603 | 1 | LCSC | C1588 | SAMSUNG(三星) | CL10B102KB8NNNC | Basic Part |
10 | 10kΩ | R1 | R0402 | 1 | LCSC | C25744 | UniOhm | 0402WGF1002TCE | Basic Part |
11 | TK-6580-2 | SW1 | SW-TH_TK-6580-2 | 1 | LCSC | C528779 | Yuandi(台湾元迪) | TK-6580-2 | Extended Part |
12 | GD32E103C8T6 | U1 | LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL | 1 | LCSC | C350804 | GigaDevice Semicon Beijing | GD32E103C8T6 | Extended Part |
Unfold
Loading...
Do you need to add this project to the album?