Editor Version ×
Standard

1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

Ongoing

STD 3.3v SPI Can Board

License: GPL 3.0

Mode: Editors' pick

  • 299
  • 1
  • 0
Update time: 2023-04-07 13:43:38
Creation time: 2022-07-04 08:14:29
Description

3.3v SPI Can Board for use with 3.3v microcontrllers

Design Drawing
schematic diagram
1 /
PCB
1 /
The preview image was not generated, please save it again in the editor.
ID Name Designator Footprint Quantity BOM_Manufacturer Part
1 100nF C1,C2,C3 CAP-TH_L5.0-W2.5-P5.00-D1.0 3 CC1H104MC1FD3F6C10MF
2 22pF C4,C5 CAP-TH_L5.5-W2.5-P5.00-D1.0 2 N06S1B220KN0B0S0N0
3 Solder bridge CAN1_TERM_SB SOLDER BRIDGE 1 Solder bridge
4 39281123 CN1 CONN-TH_39281123 1 39281123
5 1N5818G D1 DO-15_BD3.1-L6.7-P10.70-D0.9-RD 1 1N5818G
6 10K R1 RES-TH_BD2.4-L6.3-P10.30-D0.6 1 MFR-25FTE52-10K
7 4.7K R2 RES-TH_BD2.2-L6.5-P10.50-D0.6 1 MFR50SJT-52-4K7
8 120 T1 RES-TH_BD2.2-L6.5-P10.50-D0.6 1 MFR-25FTE52-120R
9 SIT65HVD230DR U1 SOP-8_L4.9-W3.9-P1.27-LS6.0-BL 1 SIT65HVD230DR
10 XL2515 U2 SOP-18_L11.4-W7.6-P1.27-LS10.6-BL 1 XL2515
11 DB125-2.54-12P-GN U6 CONN-TH_DB125-2.54-12P-GN 1 DB125-2.54-12P-GN
12 16MHz X1 OSC-TH_L10.0-W4.5-P5.00 1 X49SD16MSD2SC

Unfold

Project Attachments
Empty
Target complaint
Related Projects
Change a batch
Loading...
Add to album ×

Loading...

reminder ×

Do you need to add this project to the album?

服务时间

周一至周五 9:00~18:00
  • 0755 - 2382 4495
  • 153 6159 2675

服务时间

周一至周五 9:00~18:00
  • 立创EDA微信号

    easyeda

  • QQ交流群

    664186054

  • 立创EDA公众号

    lceda-cn