MCP23S17_V1

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STD MCP23S17_V1

License: Public Domain

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Update time： 2020-12-28 14:47:39

Creation time： 2018-04-03 13:08:54

Description

This boards should provide SPI I/O expansion based on the MCP23S17. The boards should be stackable since the layout of the SPI connector is the same for all boards. The Digital Input and the Digital Relay Output are galvanically isolated. Prototype has been tested with a Teensy 3.2 but any other SPI capable processor should work. All In and Out power supply must be provided by external power supply since only the non isolated part is powered by the processor power.

Design Drawing

schematic diagram

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MCP23S17_DI
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MCP23S17_DO
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MCP23S17_Relay
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PCB

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MCP23S16_V1_PCB
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BOM

BOM download Purchase Parts

ID	Name	Designator	Footprint	Quantity	BOM_Supplier	BOM_Manufacturer Part	BOM_Supplier Part
1	MCP23S17-E/SP	U1,U2,U9	DIP-28_300MIL	3	LCSC	MCP23S17-E/SP	C148096
2	2.54mm 2*20PFemale header	P1,P2,P3	HDR-20X2/2.54	3	LCSC	2.54mm 2*20PFemale header	C50982
3	MF-R005-0-99	F1	F-0.05A	1	LCSC	MF-R005-0-99	C89659
4	100nF	C1,C2,C3	CAP-0.2	3	LCSC	CT4-1206B104K251F3	C93117
5	210S-2*4P L=11.6MMGold-plated black	H1,H2,H3	DIP-2X4P-2.54MM-M	3	LCSC	210S-2*4P L=11.6MMGold-plated black	C124386
6	1KΩ	RN1,RN2	SIP-9	2	LCSC	A09-102JP	C9111
7	210S-1*3P L=11.6MMGold-plated black	AG,AA,A+,AG1,AA1,A+1,AG2,AA2,A+2	DIP-1X3P-2.54MM-M	9	LCSC	210S-1*3P L=11.6MMGold-plated black	C124376
8	LTV-847	U5,U6,U7,U8	DIP-16_W7.62MM	4	LCSC	LTV-847	C10794
9	ULN2803APG	U3,U4	DIP-18	2	LCSC	ULN2803APG	C5252
10	A16-400	F2	F-4.00A-16V	1	LCSC	A16-400	C135392
11	RL16-400	F3,F4	F-4.00A-16V	2	LCSC	RL16-400	C20839
12	AQY210EH	K0,K1,K2,K3,K4,K5,K6,K7,K8,K9,K10,K11,K12,K13,K14,K15	DIP-4	16	LCSC	AQY210EH	C13541
13	300	R8,R9,R10,R11,R12,R13,R14,R15,R0,R1,R2,R3,R4,R5,R6,R7	RES_0603	16	LCSC	AR03DTC3000	C374566