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Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD ESP32-Shield
Mode:
PCB_ESP32-Shield with GND
Open in EditorPCB_ESP32-Shield_21.05.21
Open in EditorPCB_ESP32-Shield_21.05.22_preFinal
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 1uF | C3 | C0805 | 1 |
2 | 330nF | C4 | C0805 | 1 |
3 | 100nF | C5 | C0805 | 1 |
4 | M7_C95872 | D1 | DO-214AC_L4.3-W2.7-LS5.3-RD | 1 |
5 | Headers Pins1x15P 2.54mm | H1,H2 | HDR-TH_15P-P2.54-V | 2 |
6 | Headers_4P | H3,H6 | HEADER_4P | 2 |
7 | Header_7P | H4,H8 | HEADER_7P | 2 |
8 | Header_2P | H5 | HEADER_2P | 1 |
9 | Header_14P | H7 | HEADER_14P | 1 |
10 | Header_2*2P | H9 | HEADER_2*2P | 1 |
11 | 333-2SYGD/S530-E2-L | IO2,IO4,IO5,IO17,LED1,LED2,LED3,LED4,LED5,LED6,LED7,LED8,LED9,LED10,LED11,LED12,LED13,LED14,LED15,LED16,LED17,LED18,LED19,LED20,LED21,LED22,LED23,LED24 | LED-TH_BD5.0-P2.54-FD | 28 |
12 | IN 12V | P4 | WJ500V-5.08-2P | 1 |
13 | 4K7 | R1,R2,R3,R4,R5,R6,R7,R8,R9,R10 | RES-TH_BD2.7-L6.2-P10.20-D0.4 | 10 |
14 | 1k | R11,R12,R13,R14,R15,R16,R17,R19,R20,R21,R22,R23,R24,R25,R26,R27,R28,R29,R30,R31,R32,R33,R34,R35,R36,R37,R38,R39 | RES_1/4W_VERTICAL | 28 |
15 | 100 | R18,R40,R42,R43,R44 | R0805 | 5 |
16 | 1K | R41 | RES-TH_BD2.7-L6.2-P10.20-D0.4 | 1 |
17 | BUZZER | SG1 | BUZZER-12MM-NS-KIT | 1 |
18 | ESP32_NodeMCU | U1 | ESP32_38PIN | 1 |
19 | 74HC595N | U2,U3,U4 | DIP-16_L20.0-W6.4-P2.54-LS7.6-BL | 3 |
20 | ULN2003 | U5,U6,U7,U8 | DIP-16_L19.2-W6.6-P2.54-LS7.6-BL | 4 |
21 | 78M05 | U9 | TO-252-2_L6.5-W6.1-P4.58-LS10.0-TL | 1 |
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