© 2024 EasyEDA Some rights reserved ISO/IEC
Brand new interactions and interfaces
Smooth support for design sizes of over 3W
devices or 10W pads
More rigorous design constraints, more
standardized processes
For enterprises, more professional users
Easy to use and quick to get started
The process supports design scales of 300
devices or 1000 pads
Supports simple circuit simulation
For students, teachers, creators
STD IPC_v1
Mode:
Indicado de posição para botoeira
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
---|---|---|---|---|---|---|---|---|
1 | 18.432Mhz | X1 | HC-49US_L11.0-W4.6-P4.88 | 1 | LCSC | C2191 | Raltron | A-3.579545-30-SL-TR |
2 | 10K | R4,R12,R3 | R0603 | 3 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
3 | 100R | R11,R10,R9,R13,R6,R8,R14 | R0603 | 7 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
4 | 10k | R1 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
5 | 680R | R2 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
6 | 1OK | R5 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
7 | 1K | R7 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
8 | BC817 | Q2,Q1 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 2 | LCSC | C8589 | CJ | BC817 |
9 | B120-13-F | D1,D2 | SMA_L4.3-W2.6-LS5.2-RD | 2 | LCSC | C134421 | Diodes Incorporated | B120-13-F |
10 | PIC16F628A-I/SO | U3 | SOIC-18_L11.6-W7.5-P1.27-LS10.3-BL | 1 | LCSC | C42089 | MICROCHIP | PIC16F628A-I/SO |
11 | Female header 2.54 1*5P | H1 | HDR-TH_5P-P2.54-V | 1 | LCSC | C46341 | ReliaPro | Female header 2.54 1*5P |
12 | 100uF | C11 | CAPACITOR ELETROLITICO 1UF | 1 | LCSC | C440818 | Rubycon | 450BXW47MEFR16X25 |
13 | 47uF | C10 | CAPACITOR ELETROLITICO 4MM | 1 | LCSC | C440818 | Rubycon | 450BXW47MEFR16X25 |
14 | FJ5101AG | DSP1,DSP2 | LED-SEG-TH_10P-L12.7-W19.0-P2.54-S15.24-BL | 2 | LCSC | C156236 | Shenzhen Zhihao Elec | FJ5101AG |
15 | Header-Male-2.54_1x4 | H2 | HDR-TH_4P-P2.54-V | 1 | LCSC | C124378 | Ckmtw | 210S-1*4P L=11.6MMGold-plated black |
16 | 47uH | L1 | IND-SMD_L5.7-W5.4 | 1 | LCSC | C475919 | cjiang(Changjiang Microelectronics Tech) | FXL1040-470-M |
17 | 100nF | C3,C4,C8,C9 | C0603 | 4 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
18 | 10nF | C5 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
19 | 100nf | C6 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
20 | 100Nf | C7 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
21 | 27pF | C1,C2 | C0603 | 2 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
22 | SN75176ADR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | C468242 | Texas Instruments | SN75176ADR |
23 | LM2594M-5.0/TR | U2 | SOP-8_L5.0-W4.0-P1.27-LS6.0-BL | 1 | LCSC | C316682 | HGSEMI | LM2594M-5.0/TR |
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