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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD Desenvolvimento de plataforma para projetos com microcontroladores

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Update time: 2020-10-21 15:48:39
Creation time: 2018-04-03 10:45:32
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ID Name Designator Footprint Quantity
1 33p C2,C3,C4,C5 RAD-0.1 4
2 12MHZ X1,X3 OSC-49S-1 2
3 1k5 R1 AXIAL-0.3 1
4 10k R2,R34,R23,R24,R25,R26,R27 AXIAL-0.3 7
5 11.0592MHZ X2 OSC-49S-1 1
6 10K RN1 SIP9 1
7 68000-103HLF JP1,JP2 68000-103HLF 2
8 DC005-2.0MM DC1 DC-5020 1
9 100nF C7 CAP-D4.0XF1.5 1
10 ICS-40P_W CI1 DIP-40_W15.24MM_SOCKET 1
11 160 R11 AXIAL-0.3 1
12 LM7805CT U5 TO-220(TO-220-3) 1
13 2.54mm 1*20P Female P1,P2 HDR-20X1/2.54 2
14 Female header1*2P P6,P7,P5 HDR-2X1/2.0 3
15 SWITCH-6X6X5_TH RST,PB0,PB1,PB2,PB3,PB4 SWITCH-6X6X5_TH 6
16 1N4004 D3 DO-41 1
17 LED-3MM LED10,LED1,LED2,LED3,LED4,LED5,LED6,LED7,LED8 LED-3MM/2.54 9
18 K8-8081D-L1 SW2,SW1 KEY-8X8 2
19 330nF C6 CAP-D4.0XF1.5 1
20 10uF C1 CAP-D4.0XF1.5 1
21 270 R3,R4,R5,R6,R7,R8,R9,R10 AXIAL-0.3 8
22 Female headerHDR1X8-2.54 P3,P8,P12 HDR-8X1/2.54 3
23 SM410561N LED9 LEDSEG_1_0.56_CATHODE 1
24 150 R12,R13,R14,R15,R16,R17,R18,R19,R22 AXIAL-0.3 9
25 22pF C9,C10 RAD-0.1 2
26 φ3 Red LED12,LED13 LED3MM 2
27 4.7u C8 CAP-D4.0XF1.5 1
28 VDG-02HG-R red ALIMEN VDG-02HG-R 1
29 2k2 R35 AXIAL-0.3 1
30 1k R28,R29 AXIAL-0.3 2
31 68 R30,R31 AXIAL-0.3 2
32 670688000 USB-B USB-B-4P-DIP-12.0X17.0-H11.0-MOLEX 1
33 VDG/S-04L GRAV VDG/S-04L 1
34 Z-10028310100100 CI2 DIP-2.54MM-28P-NEXTRON-H4.6 1
35 1N4728A D1,D2 DO-41 2
36 Female header 2.54 1*5P P4 HDR-5X1/2.54 1
37 Header2.54mm 1*3P P9 HDR-3X1/2.54 1
38 100 R20,R21 AXIAL-0.3 2
39 RGB LED_CA LED11 LED5MMRGB 1
40 Female header1*16P pitch 2.54mm P11 HDR-16X1/2.54 1
41 20K R32 VZ067TL1B 1
42 Female_header1*3P P13 HDR-3X1/2.54 1
43 1u C11,C12,C13,C14,C15 CAP-D4.0XF1.5 5
44 Z-10016320100100 CI3 DIP-16 1
45 WJ300V-5.0-3P P10 WJ300V-5.00-3P 1

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