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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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samm928

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Personal Info

Nickname samm928

Certification Title Not Yet

Location United States USA

Company

School Cleveland State University

Profession Engineering-PCB Design

Website https://www.youtube.com/watch?v=bl5TUw7sUBs

Profile Professional Sr. PCB designer since 1996 specializing in high density PCB and Flex layouts using several technologies for stack-up including multilayer HDI constructions (ELIC / buried / through vias). Most familiar with the latest Cadence Allegro 17.4 layout design package. Comfortable routing high-pin count and 0.35mm fine pitch BGAs, 1005 and 0201 chip packages. DDR4 memory with controlled length matching, HDMI display lines, controlled differential pairs and impedance matching on sensitive RF signals.

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服务时间

周一至周五 9:00~18:00
  • 0755 - 2382 4495
  • 153 6159 2675

服务时间

周一至周五 9:00~18:00
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