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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads

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Std EditionPaths & Holes

License: Public Domain

Published Time:2021-03-14 22:53:18
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Description

Micron- Probe 2021 Event

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PCB_Paths & Holes

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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 TLP2962(F) U1 DIP-8_L9.8-W6.6-P2.54-LS7.6-BL 1 LCSC TOSHIBA TLP2962(F) C146458
2 FS1508MB0810-H8.0 SPK1 BEEP-TH_BD15.0-P10.20-D1.2 1 LCSC FUET FS1508MB0810-H8.0 C969972
3 100uF C1 CAP-TH_BD6.3-P2.50-D1.0-FD 1 LCSC LELON RZW101M1VBK-0611 C134669
4 10K R6 RM063-103 1 LCSC JML RM063-103 10K C38793
5 DB129V-7.5-2P-GN-S U2-6V CONN-TH_DB129V-7.5-2P-GN-S 1 LCSC DIBO(地博电子) DB129V-7.5-2P-GN-S C2682299
6 SKQJADA010 SW1,SW2,SW3,SW4,SW5,SW6 SW-TH_4P-L6.0-W6.0-P4.50-LS6.5 6 LCSC ALPS Electric SKQJADA010 C262399
7 100nF C3,C4 RAD-0.2 2 LCSC ReliaPro 104/100V 20% C26856
8 1K R1,R2,R3,R4,R5,R7 RES-TH_BD2.7-L6.2-P10.20-D0.4 6 LCSC FlyWin MO1/4W-20K±5%-ST52 C479387

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