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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 30,000 devices or 100,000 pads

3.More rigorous design constraints, more standardized processes

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Std Edition30A_R6/option

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Project source: Cloned from 30A_R8/RS485

Published Time:2019-09-27 16:35:32
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30A_R6 / опция

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30A_R6 / опция

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ID Name Designator Footprint Quantity
1 0608 1,2,3,4,5,6 LED-0603 6
2 1u C3 CAP-D6.3XF2.5 1
3 ES1D-W D1 SMA(DO-214AC) 1
4 JFC1206-2А F1 1206 1
5 GND P2,P4,P5,P6,P7,P8 WJ762-7.62-2P 6
6 Power P10 WJ126V-5.0-2P 1
7 D-B060306B1-KS2 POWER LED0603-RD 1
8 100 R1,R2,R3,R4,R5,R6 R0805 6
9 470Ω R7 R0805 1
10 SLA-12VDC-SL-A RELAY1,RELAY2,RELAY3,RELAY4,RELAY5,RELAY6 RELAY-TH_SLA-XXVDC-XL-A 6
11 HDR-IDC-2.54-2X7P RELE_IN,RELE_OUT IDC-TH_14P-P2.54-V-R2-C7-S2.54 2
12 ULN2003ADR U2 SOIC-16_L9.9-W3.9-P1.27-LS6.0-BL 1

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