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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD PlcNode v4.4
Mode: Editors' pick
- 0
Update time：
2021-02-28 00:49:17
Creation time：
2021-02-15 01:47:47
Description
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Design Drawing
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | TIP31C | Q6,Q5 | TO-220-3_L10.0-W4.5-P2.54-T | 2 |
| 2 | LED-TH-5mm_B | LED7,LED8,LED9,LED10,LED5,LED6,LED2,LED3,LED1,LED4,LED11,LED12 | LED-TH_BD5.0_BLUE | 12 |
| 3 | HI_LINK_AC_DC_3W | U3 | HI LINK AC TO DC | 1 |
| 4 | RelayHT3F-12VDC-SHG | K1,K2,K3,K4 | RELAY-TH_HT3F-DCXX-X-X | 4 |
| 5 | BZX55C12 R0G | D5,D6,D1,D2,D3,D4 | DO-35_BD2.0-L4.2-P8.20-D0.5-RD | 6 |
| 6 | 2N2222A | Q1,Q2,Q4,Q3 | TO-92-3_L4.8-W3.7-P2.54-R | 4 |
| 7 | 1k | R13,R14,R16,R15,R17,R18 | R_AXIAL-0.3 | 6 |
| 8 | 20k | R5,R6,R2,R3,R1,R4 | R_AXIAL-0.3 | 6 |
| 9 | 3.3k | R11,R12,R8,R9,R7,R10 | R_AXIAL-0.3 | 6 |
| 10 | CONN-TH_3P-P5.08 | P7 | CONN-TH_3P-P5.00 | 1 |
| 11 | Generic_OLED_128x64_I2C | U4 | GENERIC_OLED_128X32_I2C | 1 |
| 12 | ESP32 | 1 | ESP32_DEVKIT | 1 |
| 13 | 1N4007 | D7,D8,D9,D10 | DO-41_BD2.4-L4.7-P8.70-D0.9-RD | 4 |
| 14 | CONN-TH_2P-P5.08 | P8,P9,P10,P11,P12,P13,P5,P6,P1,P2,P3,P4 | CONN-TH_2P-P5.08 | 12 |
| 15 | LM324N_C725320 | U1,U2 | DIP-14_L19.4-W6.4-P2.54-LS7.6-BL | 2 |
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